Project

Embeddable Thin Chip Packages (E-TChiP)

Acronym
E-TCHIP
Duration
16 August 2014 → 31 December 2016
Funding
Regional and community funding: Industrial Research Fund
Research disciplines
  • Engineering and technology
    • Microfabrication and manufacturing
Keywords
advanced packaging chip thinning embedding flexible electronics Packaging
 
Project description

Embeddable Thin Chip Packages (E-TChiP)

For reasons of confidentiality the project summary cannot be disclosed.

For more information please contact the (co)promoter.