Acronym
E-TCHIP
Code
F2013/IOF-STEPST/684
Duration
16 August 2014 → 31 December 2016
Funding
Regional and community funding: Industrial Research Fund
Promotor
Research disciplines
-
Engineering and technology
- Microfabrication and manufacturing
Keywords
advanced packaging
chip thinning
embedding
flexible electronics
Packaging
Project description
Embeddable Thin Chip Packages (E-TChiP)
For reasons of confidentiality the project summary cannot be disclosed.
For more information please contact the (co)promoter.