Your browser does not support JavaScript or JavaScript is not enabled. Without JavaScript some functions of this webapplication may be disabled or cause error messages. To enable JavaScript, please consult the manual of your browser or contact your system administrator.

Project

Embeddable Thin Chip Packages (E-TChiP)

Information

Project Team

Outputs and Outcomes

Promotor

Jan Vanfleteren

Department of Electronics and information systems

Copromotor

Frederik Leys

Department of Electronics and information systems