Research Explorer

Uw browser ondersteunt geen JavaScript of JavaScript is niet ingeschakeld. Zonder JavaScript kan sommige functionaliteit van deze webapplicatie uitgeschakeld zijn of foutmeldingen veroorzaken. Raadpleeg om JavaScript in te schakelen de handleiding van uw browser of contacteer uw systeembeheerder.

Onderzoeker

Peter Degraeuwe

Prijzen & Erkenningen

6 Resultaten

1993

Experimentele hoogfrekwent-karakterisatie van elektrische interconnecties met planaire contacten

Peter DegraeuweD. De ZutterL. Martens

1992

Accurate characterization of a high-speed and high-density multichip module connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 131-133.

Luc MartensPeter DegraeuweDaniël De ZutterR BargainD Mor-Lion

Characterization of a new type of MCM-connector. Workshop on VLSI Packaging Techniques and Manufacturing Technologies, Stockholm, Zweden, Jun. 1992.

Peter DegraeuweLuc MartensDaniël De ZutterR BargainD Mor-Lion

Improved time-domain characterization of high-speed interconnection structures'. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 142-144.

Tom DhaeneLuc MartensPeter DegraeuweDaniël De Zutter

Measurement set-up for high-frequency characterization of planar contact de vices. 39th Automatic RF Techniques Group (ARFTG), Albuquerque, USA, Jun. 1992.

Peter DegraeuweLuc MartensDaniël De Zutter

Measurement set-up for high-frequency and high-speed interconnections. Proc. of third European Joint Conference, pp. 2-3 1/2-3- 7, Brussels, Bel gium, 17-19 Jun. 1992.

Peter DegraeuweLuc MartensDaniël De Zutter