Research Explorer

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Researcher

Peter Degraeuwe

Awards & Distinctions

6 Results

1993

Experimentele hoogfrekwent-karakterisatie van elektrische interconnecties met planaire contacten

Peter DegraeuweD. De ZutterL. Martens

1992

Accurate characterization of a high-speed and high-density multichip module connector. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 131-133.

Luc MartensPeter DegraeuweDaniël De ZutterR BargainD Mor-Lion

Characterization of a new type of MCM-connector. Workshop on VLSI Packaging Techniques and Manufacturing Technologies, Stockholm, Zweden, Jun. 1992.

Peter DegraeuweLuc MartensDaniël De ZutterR BargainD Mor-Lion

Improved time-domain characterization of high-speed interconnection structures'. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, USA, 22-24 Apr. 1992, pp. 142-144.

Tom DhaeneLuc MartensPeter DegraeuweDaniël De Zutter

Measurement set-up for high-frequency characterization of planar contact de vices. 39th Automatic RF Techniques Group (ARFTG), Albuquerque, USA, Jun. 1992.

Peter DegraeuweLuc MartensDaniël De Zutter

Measurement set-up for high-frequency and high-speed interconnections. Proc. of third European Joint Conference, pp. 2-3 1/2-3- 7, Brussels, Bel gium, 17-19 Jun. 1992.

Peter DegraeuweLuc MartensDaniël De Zutter