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Onderzoeker
Johan De Baets
Profiel
Projecten
Publicaties
Activiteiten
Prijzen & Erkenningen
113
Resultaten
2020
An artificial iris ASIC with high voltage liquid crystal driver and 10nA light range detector and 40nA blink detector for LCD flicker removal
Bogdan Raducanu
Samira Zali
Stefano Stanzione
Chris van Liempd
Andrés Felipe Vasquez Quintero
Herbert De Smet
Johan De Baets
Chris van Hoof
Nick Van Helleputte
P1
Conferentie
2020
An artificial iris ASIC with high voltage liquid crystal driver, 10-nA light range detector and 40-nA blink detector for LCD flicker removal
Bogdan C. Raducanu
Samira Zaliasl
Stefano Stanzione
Chris van Liempd
Andrés Felipe Vasquez Quintero
Herbert De Smet
Johan De Baets
Chris van Hoof
Nick Van Helleputte
A2
Artikel in een tijdschrift
in
IEEE SOLID-STATE CIRCUITS LETTERS
2020
2019
FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
Maaike Op de Beeck
Rik Verplancke
David Schaubroeck
Changzheng Li
Dieter Cuypers
Maarten Cauwe
Bjorn Vandecasteele
Lothar Mader
Celine Vanhaverbeke
John O’Callaghan
et al.
C3
Conferentie
2019
2017
Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components
Bart Vandevelde
Filip Vanhee
Davy Pissoort
Lieven Degrendele
Johan De Baets
Bart Allaert
Ralph Lauwaert
Franco Zanon
Riet Labie
Geert Willems
A1
Artikel in een tijdschrift
in
MICROELECTRONICS RELIABILITY
2017
Passive component embedding in printed circuit boards for space applications
Maarten Cauwe
Johan De Baets
C1
Conferentie
2017
Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves
Maaike Op de Beeck
Rik Verplancke
David Schaubroeck
Dieter Cuypers
Maarten Cauwe
Bjorn Vandecasteele
John O'Callaghan
Dries Braeken
Alexandru Andrei
Andrea Firrincieli
et al.
C1
Conferentie
2017
2016
Passive component embedding in printed circuit boards for space applications
Maarten Cauwe
Johan De Baets
Gerhard Schmid
Christian Galler
Johan De Hert
Steven De Cuyper
Denis Lacombe
C1
Conferentie
2016
2015
Stretchable 45 x 80 RGB LED display using meander wiring technology
Hideki Ohmae
Yoshihiro Tomita
Mitsuhiro Kasahara
Jeroen Schram
Edsger Smits
Jeroen Van den Brand
Frederick Bossuyt
Jan Vanfleteren
Johan De Baets
C1
Conferentie
2015
2014
Embedded passive components for improved power plane decoupling
Maarten Cauwe
Johan De Baets
Arnaud Grivon
Johannes Stahr
Alexandre Amedeo
P1
Conferentie
2014
Flexible and stretchable circuit technologies for space applications
Maarten Cauwe
Frederick Bossuyt
Johan De Baets
Jan Vanfleteren
C1
Conferentie
2014
Flexible and stretchable electronics for wearable healthcare
Jeroen van den Brand
Margreet de Kok
Ashok Sridhar
Maarten Cauwe
Rik Verplancke
Frederick Bossuyt
Johan De Baets
Jan Vanfleteren
P1
Conferentie
2014
Mechanical analysis of encapsulated metal interconnects under transversal load
Bjorn Van Keymeulen
Mario Gonzalez
Frederick Bossuyt
Johan De Baets
Jan Vanfleteren
P1
Conferentie
2014
Reduced 2nd level solder joint life time of low-CTE mold compound packages
Bart Vandevelde
Riet Labie
Geert Willems
Lieven Degrendele
Maarten Cauwe
Johan De Baets
C1
Conferentie
2014
2013
Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
Maarten Cauwe
Bjorn Vandecasteele
Johan De Baets
Jeroen van den Brand
Roel Kusters
Ashok Sridhar
C1
Conferentie
2013
In situ monitoring of urine and sweat contamination in bed linen
Bjorn Van Keymeulen
Lieven Degrendele
Frederick Bossuyt
Johan De Baets
C3
Conferentie
2013
2012
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
Maarten Cauwe
Bjorn Vandecasteele
Johan De Baets
Jeroen van den Brand
Roel Kusters
Ashok Sridhar
P1
Conferentie
2012
Plastic electronics based conformable electronic circuits
Frederick Bossuyt
Sheila Dunphy
Jan Vanfleteren
Johan De Baets
KP Morillo
J Van den Brand
P1
Conferentie
2012
Surface modification of a photo definable epoxy resin with polyamines and polydopamine to improve adhesion with electroless deposited copper
David Schaubroeck
Johan De Baets
Peter Dubruel
Luc Van Vaeck
André Van Calster
C3
Conferentie
2012
Surface modification of a photo-definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
David Schaubroeck
Emilie Van den Eeckhout
Johan De Baets
Peter Dubruel
Luc Van Vaeck
André Van Calster
A1
Artikel in een tijdschrift
in
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
2012
2011
Chemical modification of a photo definable epoxy resin with polyamines to improve adhesion with electroless deposited copper
David Schaubroeck
Johan De Baets
Tim Desmet
Peter Dubruel
Etienne Schacht
Luc Van Vaeck
André Van Calster
C1
Conferentie
2011
Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
David Schaubroeck
Emilie Van den Eeckhout
Johan De Baets
Peter Dubruel
Luc Van Vaeck
André Van Calster
C3
Conferentie
2011
System-in-foil technology
Andreas Dietzel
Jeroen van den Brand
Jan Vanfleteren
Wim Christiaens
Erwin Bosman
Johan De Baets
Hoofdstuk in een boek
in
Ultra-thin chip technology and applications
2011
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
Maarten Cauwe
Bjorn Vandecasteele
An Gielen
Johan De Baets
Jeroen van den Brand
Roel Kusters
C1
Conferentie
2011
2010
Mechanistic aspects of selective laser patterning of multilayered thin-film structures in OLED fabrication
Dimitris Karnakis
Geert Van Steenberge
An Gielen
Johan De Baets
Jeroen van den Brand
C1
Conferentie
2010
Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components
Maarten Cauwe
Johan De Baets
A1
Artikel in een tijdschrift
in
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
2010
Surface modification of an epoxy resin with polyamines via cyanuric chloride coupling
David Schaubroeck
Johan De Baets
Tim Desmet
Peter Dubruel
Etienne Schacht
Luc Van Vaeck
André Van Calster
A1
Artikel in een tijdschrift
in
APPLIED SURFACE SCIENCE
2010
2009
A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources
Rajesh Mandamparambil
Henri Fledderus
Jeroen van den Brand
Milan Saalmink
Roel Kusters
Tomas Podprocky
Geert Van Steenberge
Johan De Baets
Andreas Dietzel
P1
Conferentie
2009
Chemical modification of a photo definable epoxy resin to improve adhesion with electroless copper
David Schaubroeck
Johan De Baets
Etienne Schacht
André Van Calster
C3
Conferentie
2009
Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification
David Schaubroeck
Johan De Baets
Tim Desmet
Sandra Van Vlierberghe
Etienne Schacht
André Van Calster
A1
Artikel in een tijdschrift
in
APPLIED SURFACE SCIENCE
2009
2008
Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
Maarten Cauwe
Johan De Baets
A1
Artikel in een tijdschrift
in
IEEE TRANSACTIONS ON ADVANCED PACKAGING
2008
Industrial and technical aspects of chip embedding technology
Andreas Ostmann
Dionysios Manessis
Johannes Stahr
Mark Beesley
Maarten Cauwe
Johan De Baets
P1
Conferentie
2008
Systems-in-foil: devices, fabrication processes and reliability issues
J van den Brand
Johan De Baets
T van Mol
A Dietzel
A1
Artikel in een tijdschrift
in
MICROELECTRONICS RELIABILITY
2008
2007
Advanced substrates and packages for wearable electronics and sensors
Jan Vanfleteren
Herbert De Smet
Johan De Baets
André Van Calster
C1
Conferentie
2007
Cost modelling for embedded component technology
Johan De Baets
G WILLEMS
A OSTMANN
A KRIECHBAUM
H KOSTNER
C1
Conferentie
2007
High-frequency modeling and measurements of tracks running on top of active components embedded in printed circuit boards
Maarten Cauwe
Johan De Baets
C1
Conferentie
2007
Stretchable conductor technology for elastic electronic systems
Johan De Baets
Fabrice Axisa
Dominique Brosteaux
M Gonzalez
T Loeher
D Manessis
R Heinrich
B Schmied
A Ostmann
Jan Vanfleteren
C3
Conferentie
2007
2006
Embedding active components as a 3D packaging solution
Maarten Cauwe
Wim Christiaens
Jan Vanfleteren
Johan De Baets
A2
Artikel in een tijdschrift
in
Advancing Microelectronics
2006
High-frequency characterization of embedded active components in printed circuit boards
Maarten Cauwe
Johan De Baets
André Van Calster
P1
Conferentie
2006
Improvement of copper adhesion by chemical modification of epoxy surfaces.
B DE ROO
Alfons Vervaet
Etienne Schacht
An Gielen
Johan De Baets
André Van Calster
C1
Conferentie
2006
Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics
Alfons Vervaet
Sam Siau
Johan De Baets
Boniface Manirambona
A1
Artikel in een tijdschrift
in
APPLIED SURFACE SCIENCE
2006
Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers
Sam Siau
Alfons Vervaet
Lieven Degrendele
Johan De Baets
André Van Calster
A1
Artikel in een tijdschrift
in
APPLIED SURFACE SCIENCE
2006
Stretchable electronic systems
T LOHER
D MANESSIS
R HEINRICH
B SCHMIED
Jan Vanfleteren
Johan De Baets
A OSTMANN
H REICHL
P1
Conferentie
2006
2005
Image processing techniques for characterisation of polymer wear debris
Pieter Samyn
Jan Quintelier
Johan De Baets
Alessandro Ledda
C1
Conferentie
2005
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
Sam Siau
Johan De Baets
André Van Calster
L HEREMANS
Sofie Tanghe
A1
Artikel in een tijdschrift
in
MICROELECTRONICS RELIABILITY
2005
Technology for Embedding Active Dies
Johan De Baets
C1
Conferentie
2005
2004
A parallel optical interconnect link with on-chip optical access
Ronny Bockstaele
Michiel De Wilde
Wim Meeus
Olivier Rits
Hannes Lambrecht
Jan Van Campenhout
Johan De Baets
Peter Van Daele
Eric van den Berg
Michaela Klemenc
et al.
P1
Conferentie
2004
Redistribution on wafer: an alternative, cost-efficient approach
Herbert De Pauw
Nadine Carchon
Johan De Baets
André Van Calster
C1
Conferentie
2004
2003
Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers : overplating reliability considerations for the solder mask
Sam Siau
Lieven Degrendele
Johan De Baets
André Van Calster
P1
Conferentie
2003
Excimer laser microvia-technology in multichip modules
Boniface Manirambona
Johan De Baets
Alfons Vervaet
A1
Artikel in een tijdschrift
in
APPLIED SURFACE SCIENCE
2003
Integrated optics in a standard MCM-D motherboard technology demonstrated i O/E measurement probes
Herbert De Pauw
Johan De Baets
Jan Vanfleteren
André Van Calster
C1
Conferentie
2003
Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes
Herbert De Pauw
Johan De Baets
Jan Vanfleteren
André Van Calster
P1
Conferentie
2003
Integration of Thick Film resistors in a multilayer structure
Tomas Podprocky
Bjorn Vandecasteele
Johan De Baets
André Van Calster
C1
Conferentie
2003
Integration of thick film resitors in a multilayer structure
Tomas Podprocky
Bjorn Vandecasteele
Johan De Baets
André Van Calster
J BANSKY
P1
Conferentie
2003
Optimization of microvia-technology using an excimer laser for application in microelectronics
Boniface Manirambona
Johan De Baets
Alfons Vervaet
C1
Conferentie
2003
Thick film inductors for RF applications
Tomas Podprocky
Bjorn Vandecasteele
Johan De Baets
André Van Calster
C1
Conferentie
2003
2002
An O/E measurement probe based on an optics-extended MCM-D motherboard technology
Herbert De Pauw
Johan De Baets
Jan Vanfleteren
André Van Calster
P1
Conferentie
2002
2001
Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations
Herbert De Pauw
Jan Vanfleteren
Johan De Baets
André Van Calster
P1
Conferentie
2001
Standard SMT process for flip-chip assembly on FR4 substrate
S HARRIS
G PATRA
G SCHOLS
D MATHELIN
Dorina Corlatan
E RAEDSCHELDER
P DE LANGHE
Johan De Baets
C1
Conferentie
2001
1999
A new approach to flip chip on board technology using SMT compatible processes.
Suixin Zhang
Johan De Baets
André Van Calster
[0-9]{2}
1999
A new approach to flip chip on board technology using SMT compatible processes.
Suixin Zhang
Johan De Baets
André Van Calster
C1
Conferentie
1999
Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies.
Jan Vanfleteren
Johan De Baets
André Van Calster
G SCHOLS
N PERGOOT
E JARVINEN
A AINTILA
C1
Conferentie
1999
Low Cost High-Density Multilayer Circuits for MCM-C.
I BORN
D DETEMMERMAN
Johan De Baets
André Van Calster
C1
Conferentie
1999
Low cost high-density multilayer circuits for MCM-C.
I Born
D Detemmerman
M Vrana
Johan De Baets
André Van Calster
[0-9]{2}
1999
Photovia technology: Some important aspects for reliability
Suixin Zhang
Johan De Baets
André Van Calster
Dorina Corlatan
Pascal De Langhe
Koenraad Allaert
P1
Conferentie
1999
Photovia technology: Some important aspects for reliability.
Suixin Zhang
Johan De Baets
André Van Calster
Dorina Corlatan
P DE LANGHE
Koenraad Allaert
C1
Conferentie
1999
Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.
Suixin Zhang
Johan De Baets
Maria Vereeken
Alfons Vervaet
André Van Calster
A1
Artikel in een tijdschrift
in
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
1999
1998
The fabrication and reliability of a photovia test vehicle for MCM-L applications.
Suixin Zhang
Maria Vereeken
Johan De Baets
André Van Calster
P1
Conferentie
1998
1997
A poly-CdSe active matrix for PNLC projection displays
Nadine Carchon
Geert Van Doorselaer
Ann De Cubber
Johan De Baets
André Van Calster
P CANDRY
Jef Bruggeman
P1
Conferentie
1997
Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly
S Zang
M Vereecken
Johan De Baets
André Van Calster
Alfons Vervaet
J Peeters
Koenraad Allaert
[0-9]{2}
1997
Flip-chip assembly for chips with gold bumps on high density thick film substrates
M VRANA
Johan De Baets
André Van Calster
Bart Allaert
C1
Conferentie
1997
Technology and circuit aspects of reflective PNLC microdisplays
Jean Van Den Steen
Nadine Carchon
Geert Van Doorselaer
Christof De Backere
Johan De Baets
Herbert De Smet
Joeri De Vos
Jo Lernout
Jan Vanfleteren
André Van Calster
et al.
C1
Conferentie
1997
1996
A Poly-CdSe Active matrix for PNLC projection Displays
Nadine Carchon
Geert Van Doorselaer
AM DE CUBBER
Johan De Baets
André Van Calster
P CANDRY
J BRUGGEMAN
C1
Conferentie
1996
An Anisotropie Adhesive Flip-Chip Technology for LCD Drivers
M Vrana
Johan De Baets
André Van Calster
Dominique Wojciechowski
[0-9]{2}
1996
Flip-chip technology for chip-on-glass applications (LCD)
Dominique Wojciechowski
André Van Calster
M VRANA
Johan De Baets
M DE CALUWE
P BOSCH
C1
Conferentie
1996
1995
A new cost-effective TAB technology for small and medium volumes
A DRA VET
S SECHEZ
André Van Calster
Johan De Baets
Jan Vanfleteren
Koenraad Allaert
P VETTER
M FORREST
G SCHOLS
K DECKELMANN
et al.
C1
Conferentie
1995
Design of an x-Si active matrix for high resolution reflective displays
Johan De Baets
André Van Calster
Herbert De Smet
Jean Van Den Steen
Geert Van Doorselaer
Dominique Wojciechowski
Guust Schols
Johan Witters
C1
Conferentie
1995
Modelling poly-CdSe TFTs for AMLCD
Johan De Baets
André Van Calster
Ann De Cubber
Herbert De Smet
Jan Vanfleteren
C1
Conferentie
1995
Modelling poly-CdSe TFTs for AMLCD
Johan De Baets
André Van Calster
Ann Marie De Cubber
Herbert De Smet
Jan Vanfleteren
C1
Conferentie
1995
New model for the characterization and simulation of TFTs in all operating regions
Herbert De Smet
Johan De Baets
AM DE CUBBER
Joeri De Vos
André Van Calster
Jan Vanfleteren
A2
Artikel in een tijdschrift
in
Journal of the Society for Information Display, Vol. 3, No. 3, december
1995
1994
A simplified 3-step fabrication scheme for high mobility AMLCD panels
André Van Calster
Ann De Cubber
Johan De Baets
Herbert De Smet
Jan Vanfleteren
C1
Conferentie
1994
Analysis of transient photoconductivity in CdSe:Cu:Cl thin films
Jan Capon
Johan De Baets
Ann Marie De Cubber
Herbert De Smet
André Van Calster
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
PHYSICA STATUS SOLIDI A-APPLIED RESEARCH
1994
1993
A lensless contact-type image sensor-based on a CdSe photoconductive array
Jan Capon
Johan De Baets
Igor De Rycke
Herbert De Smet
Jan Doutreloigne
André Van Calster
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
SENSORS AND ACTUATORS A-PHYSICAL
1993
A polymer-network liquid-crystal poly-CdSe-TFT active-matrix display
Johan De Baets
Jan Capon
I De Rycke
Herbert De Smet
Jan Doutreloigne
André Van Calster
Jan Vanfleteren
T Fujisawa
H Ogawa
H Takatsu
A2
Artikel in een tijdschrift
in
JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY
1993
Hysteresis phenomena in active matrix adressed polymer network Liquid Crystal Displays
Johan De Baets
Jan Capon
Ann De Cubber
Herbert De Smet
André Van Calster
Jan Vanfleteren
T Fujisawa
H Ogawa
M Aizawa
H Takatsu
C1
Conferentie
1993
1992
Active matrix design for polymer network liquid crystal projection displays
Johan De Baets
André Van Calster
Jan Capon
Igor De Rycke
Herbert De Smet
Jan Doutreloigne
Jan Vanfleteren
Toru Fujisawa
H Ogawa
H Takatsu
C1
Conferentie
1992
CdSe thin film transistors for the addressing of liquid crystal displays
André Van Calster
Jan Vanfleteren
Jan Capon
Johan De Baets
Igor De Rycke
Herbert De Smet
Jan Doutreloigne
C1
Conferentie
1992
CdSe-based thin-film integrated optical sensors
Jan Capon
Johan De Baets
Igor De Rycke
Herbert De Smet
Jan Doutreloigne
André Van Calster
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
SENSORS AND ACTUATORS A-PHYSICAL
1992
Silicon oxynitride layers for device passivation
Johan De Baets
André Van Calster
Jan Capon
Igor De Rycke
Herbert De Smet
Jan Doutreloigne
Jan Vanfleteren
Geert Nachtergaele
Sylvain Demolder
C1
Conferentie
1992
Thin-film cadmium selenide technology in large area active matrix high resolution displays
Jim Farrell
Mike Westcott
André Van Calster
Johan De Baets
Igor De Rycke
Jan Capon
Herbert De Smet
Jan Doutreloigne
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
MICROELECTRONIC ENGINEERING
1992
1991
A polymer network liquid crystal poly-CdSe TFT active matrix display
Johan De Baets
Jan Capon
I De Rycke
Herbert De Smet
Jan Doutreloigne
André Van Calster
Jan Vanfleteren
J Fujisawa
H Ogawa
P1
Conferentie
1991
CdSe based thin film integrated optical sensors
Jan Capon
Johan De Baets
Igor De Rycke
Herbert De Smet
Jan Doutreloigne
André Van Calster
Jan Vanfleteren
C3
Conferentie
1991
Evaluation of a 64x64 CdSe TFT addressed ACTFEL display demonstrator
Jan Vanfleteren
Jan Capon
Johan De Baets
Igor De Rycke
Herbert De Smet
Jan Doutreloigne
André Van Calster
Patrick De Visschere
K Sallmen
R Graeffe
P1
Conferentie
1991
Failure mechanisms in dielectrics
R Vanden Berghe
S Demolder
M Saille
Koenraad Allaert
Anita De Bruycker
Johan De Baets
André Van Calster
Jan Vanfleteren
Igor De Rycke
Herbert De Smet
et al.
P1
Conferentie
1991
1990
2-MHz clocked LCD drivers on glass
Igor De Rycke
André Van Calster
Jan Vanfleteren
Johan De Baets
Jan Doutreloigne
Herbert De Smet
Peter Vetter
A1
Artikel in een tijdschrift
in
IEEE JOURNAL OF SOLID-STATE CIRCUITS
1990
A correlation between I/F-noise and short-term drift in poly-CdSe- in thin-film transistors
Jan Doutreloigne
Johan De Baets
Igor De Rycke
Herbert De Smet
André Van Calster
Jan Vanfleteren
P1
Conferentie
1990
Complementary CdSe In/Ge Cu TFT circuits for integrated display drivers
Jan Doutreloigne
Herbert De Smet
Johan De Baets
Igor De Rycke
André Van Calster
Jan Vanfleteren
P1
Conferentie
1990
Design of a prototype active matrix CdSe TFT addressed EL display
Jan Vanfleteren
Johan De Baets
Igor De Rycke
Herbert De Smet
Jan Doutreloigne
André Van Calster
Patrick De Visschere
K Sallmen
R Graeffe
P1
Conferentie
1990
High-voltage polycrystalline CdSe thin-film transistors
Johan De Baets
Jan Vanfleteren
Igor De Rycke
Jan Doutreloigne
André Van Calster
Patrick De Visschere
A1
Artikel in een tijdschrift
in
IEEE TRANSACTIONS ON ELECTRON DEVICES
1990
The electrical performance of a complementary CdSe:In/Ge:Cu thin film transistor technology for flat panel displays
Jan Doutreloigne
Johan De Baets
Igor De Rycke
Herbert De Smet
André Van Calster
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
SOLID-STATE ELECTRONICS
1990
The influence of low copper-doping concentrations on the recrystallisation process in and the electrical-properties of germanium in Ge-Cu thin-film transistors
Jan Doutreloigne
Johan De Baets
Igor De Rycke
Herbert De Smet
André Van Calster
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
THIN SOLID FILMS
1990
Thin film transistors for flat screen displays
André Van Calster
Johan De Baets
Igor De Rycke
Herbert De Smet
Jan Doutreloigne
Jan Vanfleteren
A2
Artikel in een tijdschrift
in
ALTA FREQUENZA : RIVISTA DI ELETTRONICA
1990
1988
On the field effect in polycrystalline CdSe thin-film transistors
André Van Calster
Jan Vanfleteren
I De Rycke
Johan De Baets
A1
Artikel in een tijdschrift
in
JOURNAL OF APPLIED PHYSICS
1988
Polycrystalline CdSe films for thin film transistors.
André Van Calster
Alfons Vervaet
Igor De Rycke
Johan De Baets
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
JOURNAL OF CRYSTAL GROWTH
1988
1987
A new technology for fast switching-circuits on glass
André Van Calster
Igor DeRycke
Alfons Vervaet
Johan De Baets
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
IEEE ELECTRON DEVICE LETTERS
1987
Polycrystalline CdSe films for Thin Film Transistors.
André Van Calster
Alfons Vervaet
Igor De Rycke
Johan De Baets
C1
Conferentie
1987
1986
Polycrystalline CdSe Films for Thin Film Transistors.
André Van Calster
Alfons Vervaet
Igor De Rycke
Johan De Baets
J VANFLETEREN
C1
Conferentie
1986
Active matrix with integrated drivers on soda-lime glass using poly-CdSe and poly-Ge. Journal of the SID, Vol. 1/4, pp. 423-428, 1993.
Herbert De Smet
Jan Capon
Johan De Baets
I DE RUCKE
Jan Doutreloigne
André Van Calster
Jan Vanfleteren
A2
Artikel in een tijdschrift
Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.
André Van Calster
Johan De Baets
Jan Vanfleteren
A DRAVET
Koenraad Allaert
E CORTES
K DECKELMAN
G SCHOLS
C1
Conferentie
CdSe Thin Film Transistors for the Adressing of Liquid Crystal Displays. Voorgesteld op de 'Summer European Liquid Crystal Conference', Vilnius, Lithouwen, 1991.
André Van Calster
Jan Vanfleteren
Jan Capon
Johan De Baets
I DE RYCKE
Herbert De Smet
J DOUTERLOIGNE
C1
Conferentie
Generalised TFT-Model for 4-Quadrant Simulations. Proc. of the 3rd Int. CdSe Workshop, Strasbourg, 1993.
Herbert De Smet
Jan Capon
Johan De Baets
Ann De Cubber
André Van Calster
Jan Vanfleteren
C1
Conferentie
Geometric Design of Lensless Photoconductive Cotact-type Image Sensors. Journal of the SID, Vol. 1, Nr. 2, pp. 233-241, 1993.
Jan Capon
Johan De Baets
I DE RYCKE
Herbert De Smet
Jan Doutreloigne
André Van Calster
Jan Vanfleteren
A2
Artikel in een tijdschrift
On the Physical Properties of a New HVTFT Design. Proc. of the 3rd Int. CdSe Workshop, Strasbourg, 1993.
André Van Calster
Johan De Baets
Ann De Cubber
Jan Capon
Herbert De Smet
Jan Vanfleteren
C1
Conferentie
Thin Film Technologies for High Density Active Matrix Adressed Displays. Proc. of the 9th European Hybrid Microelectronics Conf., pp. 84-90, Nice, 1993.
André Van Calster
Johan De Baets
Ann De Cubber
Herbert De Smet
Jan Capon
Jan Vanfleteren
J FARELL
M WESTCOTT
C1
Conferentie