Research Explorer

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Researcher

Johan De Baets

Awards & Distinctions

113 Results

2020

An artificial iris ASIC with high voltage liquid crystal driver and 10nA light range detector and 40nA blink detector for LCD flicker removal

Bogdan RaducanuSamira ZaliStefano StanzioneChris van LiempdAndrés Felipe Vasquez QuinteroHerbert De SmetJohan De BaetsChris van HoofNick Van Helleputte

An artificial iris ASIC with high voltage liquid crystal driver, 10-nA light range detector and 40-nA blink detector for LCD flicker removal

Bogdan C. RaducanuSamira ZaliaslStefano StanzioneChris van LiempdAndrés Felipe Vasquez QuinteroHerbert De SmetJohan De BaetsChris van HoofNick Van Helleputte

A2 Journal Article in IEEE SOLID-STATE CIRCUITS LETTERS

2019

FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers

Maaike Op de BeeckRik VerplanckeDavid SchaubroeckChangzheng LiDieter CuypersMaarten CauweBjorn VandecasteeleLothar MaderCeline VanhaverbekeJohn O’Callaghan et al.

2017

Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components

Bart VandeveldeFilip VanheeDavy PissoortLieven DegrendeleJohan De BaetsBart AllaertRalph LauwaertFranco ZanonRiet LabieGeert Willems

A1 Journal Article in MICROELECTRONICS RELIABILITY

Passive component embedding in printed circuit boards for space applications

Maarten CauweJohan De Baets

Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves

Maaike Op de BeeckRik VerplanckeDavid SchaubroeckDieter CuypersMaarten CauweBjorn VandecasteeleJohn O'CallaghanDries BraekenAlexandru AndreiAndrea Firrincieli et al.

2016

Passive component embedding in printed circuit boards for space applications

Maarten CauweJohan De BaetsGerhard SchmidChristian GallerJohan De HertSteven De CuyperDenis Lacombe

2015

Stretchable 45 x 80 RGB LED display using meander wiring technology

Hideki OhmaeYoshihiro TomitaMitsuhiro KasaharaJeroen SchramEdsger SmitsJeroen Van den BrandFrederick BossuytJan VanfleterenJohan De Baets

2014

Embedded passive components for improved power plane decoupling

Maarten CauweJohan De BaetsArnaud GrivonJohannes StahrAlexandre Amedeo

Flexible and stretchable circuit technologies for space applications

Maarten CauweFrederick BossuytJohan De BaetsJan Vanfleteren

Flexible and stretchable electronics for wearable healthcare

Jeroen van den BrandMargreet de KokAshok SridharMaarten CauweRik VerplanckeFrederick BossuytJohan De BaetsJan Vanfleteren

Mechanical analysis of encapsulated metal interconnects under transversal load

Bjorn Van KeymeulenMario GonzalezFrederick BossuytJohan De BaetsJan Vanfleteren

Reduced 2nd level solder joint life time of low-CTE mold compound packages

Bart VandeveldeRiet LabieGeert WillemsLieven DegrendeleMaarten CauweJohan De Baets

2013

Active and passive component embedding into low-cost plastic substrates aimed at smart system applications

Maarten CauweBjorn VandecasteeleJohan De BaetsJeroen van den BrandRoel KustersAshok Sridhar

In situ monitoring of urine and sweat contamination in bed linen

Bjorn Van KeymeulenLieven DegrendeleFrederick BossuytJohan De Baets

2012

A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

Maarten CauweBjorn VandecasteeleJohan De BaetsJeroen van den BrandRoel KustersAshok Sridhar

Plastic electronics based conformable electronic circuits

Frederick BossuytSheila DunphyJan VanfleterenJohan De BaetsKP MorilloJ Van den Brand

Surface modification of a photo definable epoxy resin with polyamines and polydopamine to improve adhesion with electroless deposited copper

David SchaubroeckJohan De BaetsPeter DubruelLuc Van VaeckAndré Van Calster

Surface modification of a photo-definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper

David SchaubroeckEmilie Van den EeckhoutJohan De BaetsPeter DubruelLuc Van VaeckAndré Van Calster

A1 Journal Article in JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY

2011

Chemical modification of a photo definable epoxy resin with polyamines to improve adhesion with electroless deposited copper

David SchaubroeckJohan De BaetsTim DesmetPeter DubruelEtienne SchachtLuc Van VaeckAndré Van Calster

Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper

David SchaubroeckEmilie Van den EeckhoutJohan De BaetsPeter DubruelLuc Van VaeckAndré Van Calster

System-in-foil technology

Andreas DietzelJeroen van den BrandJan VanfleterenWim ChristiaensErwin BosmanJohan De Baets

Bookchapter in Ultra-thin chip technology and applications

Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils

Maarten CauweBjorn VandecasteeleAn GielenJohan De BaetsJeroen van den BrandRoel Kusters

2010

Mechanistic aspects of selective laser patterning of multilayered thin-film structures in OLED fabrication

Dimitris KarnakisGeert Van SteenbergeAn GielenJohan De BaetsJeroen van den Brand

Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components

Maarten CauweJohan De Baets

A1 Journal Article in IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

Surface modification of an epoxy resin with polyamines via cyanuric chloride coupling

David SchaubroeckJohan De BaetsTim DesmetPeter DubruelEtienne SchachtLuc Van VaeckAndré Van Calster

A1 Journal Article in APPLIED SURFACE SCIENCE

2009

A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources

Rajesh MandamparambilHenri FledderusJeroen van den BrandMilan SaalminkRoel KustersTomas PodprockyGeert Van SteenbergeJohan De BaetsAndreas Dietzel

Chemical modification of a photo definable epoxy resin to improve adhesion with electroless copper

David SchaubroeckJohan De BaetsEtienne SchachtAndré Van Calster

Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification

David SchaubroeckJohan De BaetsTim DesmetSandra Van VlierbergheEtienne SchachtAndré Van Calster

A1 Journal Article in APPLIED SURFACE SCIENCE

2008

Broadband material parameter characterization for practical high-speed interconnects on printed circuit board

Maarten CauweJohan De Baets

A1 Journal Article in IEEE TRANSACTIONS ON ADVANCED PACKAGING

Industrial and technical aspects of chip embedding technology

Andreas OstmannDionysios ManessisJohannes StahrMark BeesleyMaarten CauweJohan De Baets

Systems-in-foil: devices, fabrication processes and reliability issues

J van den BrandJohan De BaetsT van MolA Dietzel

A1 Journal Article in MICROELECTRONICS RELIABILITY

2007

Advanced substrates and packages for wearable electronics and sensors

Jan VanfleterenHerbert De SmetJohan De BaetsAndré Van Calster

Cost modelling for embedded component technology

Johan De BaetsG WILLEMSA OSTMANNA KRIECHBAUMH KOSTNER

High-frequency modeling and measurements of tracks running on top of active components embedded in printed circuit boards

Maarten CauweJohan De Baets

Stretchable conductor technology for elastic electronic systems

Johan De BaetsFabrice AxisaDominique BrosteauxM GonzalezT LoeherD ManessisR HeinrichB SchmiedA OstmannJan Vanfleteren

2006

Embedding active components as a 3D packaging solution

Maarten CauweWim ChristiaensJan VanfleterenJohan De Baets

A2 Journal Article in Advancing Microelectronics

High-frequency characterization of embedded active components in printed circuit boards

Maarten CauweJohan De BaetsAndré Van Calster

Improvement of copper adhesion by chemical modification of epoxy surfaces.

B DE ROOAlfons VervaetEtienne SchachtAn GielenJohan De BaetsAndré Van Calster

Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Alfons VervaetSam SiauJohan De BaetsBoniface Manirambona

A1 Journal Article in APPLIED SURFACE SCIENCE

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam SiauAlfons VervaetLieven DegrendeleJohan De BaetsAndré Van Calster

A1 Journal Article in APPLIED SURFACE SCIENCE

Stretchable electronic systems

T LOHERD MANESSISR HEINRICHB SCHMIEDJan VanfleterenJohan De BaetsA OSTMANNH REICHL

2005

Image processing techniques for characterisation of polymer wear debris

Pieter SamynJan QuintelierJohan De BaetsAlessandro Ledda

Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards

Sam SiauJohan De BaetsAndré Van CalsterL HEREMANSSofie Tanghe

A1 Journal Article in MICROELECTRONICS RELIABILITY

Technology for Embedding Active Dies

2004

A parallel optical interconnect link with on-chip optical access

Ronny BockstaeleMichiel De WildeWim MeeusOlivier RitsHannes LambrechtJan Van CampenhoutJohan De BaetsPeter Van DaeleEric van den BergMichaela Klemenc et al.

Redistribution on wafer: an alternative, cost-efficient approach

Herbert De PauwNadine CarchonJohan De BaetsAndré Van Calster

2003

Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers : overplating reliability considerations for the solder mask

Sam SiauLieven DegrendeleJohan De BaetsAndré Van Calster

Excimer laser microvia-technology in multichip modules

Boniface ManirambonaJohan De BaetsAlfons Vervaet

A1 Journal Article in APPLIED SURFACE SCIENCE

Integrated optics in a standard MCM-D motherboard technology demonstrated i O/E measurement probes

Herbert De PauwJohan De BaetsJan VanfleterenAndré Van Calster

Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes

Herbert De PauwJohan De BaetsJan VanfleterenAndré Van Calster

Integration of Thick Film resistors in a multilayer structure

Tomas PodprockyBjorn VandecasteeleJohan De BaetsAndré Van Calster

Integration of thick film resitors in a multilayer structure

Tomas PodprockyBjorn VandecasteeleJohan De BaetsAndré Van CalsterJ BANSKY

Optimization of microvia-technology using an excimer laser for application in microelectronics

Boniface ManirambonaJohan De BaetsAlfons Vervaet

Thick film inductors for RF applications

Tomas PodprockyBjorn VandecasteeleJohan De BaetsAndré Van Calster

2002

An O/E measurement probe based on an optics-extended MCM-D motherboard technology

Herbert De PauwJohan De BaetsJan VanfleterenAndré Van Calster

2001

Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations

Herbert De PauwJan VanfleterenJohan De BaetsAndré Van Calster

Standard SMT process for flip-chip assembly on FR4 substrate

S HARRISG PATRAG SCHOLSD MATHELINDorina CorlatanE RAEDSCHELDERP DE LANGHEJohan De Baets

1999

A new approach to flip chip on board technology using SMT compatible processes.

Suixin ZhangJohan De BaetsAndré Van Calster

A new approach to flip chip on board technology using SMT compatible processes.

Suixin ZhangJohan De BaetsAndré Van Calster

Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies.

Jan VanfleterenJohan De BaetsAndré Van CalsterG SCHOLSN PERGOOTE JARVINENA AINTILA

Low Cost High-Density Multilayer Circuits for MCM-C.

I BORND DETEMMERMANJohan De BaetsAndré Van Calster

Low cost high-density multilayer circuits for MCM-C.

I BornD DetemmermanM VranaJohan De BaetsAndré Van Calster

Photovia technology: Some important aspects for reliability

Suixin ZhangJohan De BaetsAndré Van CalsterDorina CorlatanPascal De LangheKoenraad Allaert

Photovia technology: Some important aspects for reliability.

Suixin ZhangJohan De BaetsAndré Van CalsterDorina CorlatanP DE LANGHEKoenraad Allaert

Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.

Suixin ZhangJohan De BaetsMaria VereekenAlfons VervaetAndré Van Calster

A1 Journal Article in JOURNAL OF THE ELECTROCHEMICAL SOCIETY

1998

The fabrication and reliability of a photovia test vehicle for MCM-L applications.

Suixin ZhangMaria VereekenJohan De BaetsAndré Van Calster

1997

A poly-CdSe active matrix for PNLC projection displays

Nadine CarchonGeert Van DoorselaerAnn De CubberJohan De BaetsAndré Van CalsterP CANDRYJef Bruggeman

Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly

S ZangM VereeckenJohan De BaetsAndré Van CalsterAlfons VervaetJ PeetersKoenraad Allaert

Flip-chip assembly for chips with gold bumps on high density thick film substrates

M VRANAJohan De BaetsAndré Van CalsterBart Allaert

Technology and circuit aspects of reflective PNLC microdisplays

Jean Van Den SteenNadine CarchonGeert Van DoorselaerChristof De BackereJohan De BaetsHerbert De SmetJoeri De VosJo LernoutJan VanfleterenAndré Van Calster et al.

1996

A Poly-CdSe Active matrix for PNLC projection Displays

Nadine CarchonGeert Van DoorselaerAM DE CUBBERJohan De BaetsAndré Van CalsterP CANDRYJ BRUGGEMAN

An Anisotropie Adhesive Flip-Chip Technology for LCD Drivers

M VranaJohan De BaetsAndré Van CalsterDominique Wojciechowski

Flip-chip technology for chip-on-glass applications (LCD)

Dominique WojciechowskiAndré Van CalsterM VRANAJohan De BaetsM DE CALUWEP BOSCH

1995

A new cost-effective TAB technology for small and medium volumes

A DRA VETS SECHEZAndré Van CalsterJohan De BaetsJan VanfleterenKoenraad AllaertP VETTERM FORRESTG SCHOLSK DECKELMANN et al.

Design of an x-Si active matrix for high resolution reflective displays

Johan De BaetsAndré Van CalsterHerbert De SmetJean Van Den SteenGeert Van DoorselaerDominique WojciechowskiGuust ScholsJohan Witters

Modelling poly-CdSe TFTs for AMLCD

Johan De BaetsAndré Van CalsterAnn De CubberHerbert De SmetJan Vanfleteren

Modelling poly-CdSe TFTs for AMLCD

Johan De BaetsAndré Van CalsterAnn Marie De CubberHerbert De SmetJan Vanfleteren

New model for the characterization and simulation of TFTs in all operating regions

Herbert De SmetJohan De BaetsAM DE CUBBERJoeri De VosAndré Van CalsterJan Vanfleteren

A2 Journal Article in Journal of the Society for Information Display, Vol. 3, No. 3, december

1994

A simplified 3-step fabrication scheme for high mobility AMLCD panels

André Van CalsterAnn De CubberJohan De BaetsHerbert De SmetJan Vanfleteren

Analysis of transient photoconductivity in CdSe:Cu:Cl thin films

Jan CaponJohan De BaetsAnn Marie De CubberHerbert De SmetAndré Van CalsterJan Vanfleteren

A1 Journal Article in PHYSICA STATUS SOLIDI A-APPLIED RESEARCH

1993

A lensless contact-type image sensor-based on a CdSe photoconductive array

Jan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan Vanfleteren

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

A polymer-network liquid-crystal poly-CdSe-TFT active-matrix display

Johan De BaetsJan CaponI De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan VanfleterenT FujisawaH OgawaH Takatsu

A2 Journal Article in JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY

Hysteresis phenomena in active matrix adressed polymer network Liquid Crystal Displays

Johan De BaetsJan CaponAnn De CubberHerbert De SmetAndré Van CalsterJan VanfleterenT FujisawaH OgawaM AizawaH Takatsu

1992

Active matrix design for polymer network liquid crystal projection displays

Johan De BaetsAndré Van CalsterJan CaponIgor De RyckeHerbert De SmetJan DoutreloigneJan VanfleterenToru FujisawaH OgawaH Takatsu

CdSe thin film transistors for the addressing of liquid crystal displays

André Van CalsterJan VanfleterenJan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan Doutreloigne

CdSe-based thin-film integrated optical sensors

Jan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan Vanfleteren

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

Silicon oxynitride layers for device passivation

Johan De BaetsAndré Van CalsterJan CaponIgor De RyckeHerbert De SmetJan DoutreloigneJan VanfleterenGeert NachtergaeleSylvain Demolder

Thin-film cadmium selenide technology in large area active matrix high resolution displays

Jim FarrellMike WestcottAndré Van CalsterJohan De BaetsIgor De RyckeJan CaponHerbert De SmetJan DoutreloigneJan Vanfleteren

A1 Journal Article in MICROELECTRONIC ENGINEERING

1991

A polymer network liquid crystal poly-CdSe TFT active matrix display

Johan De BaetsJan CaponI De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan VanfleterenJ FujisawaH Ogawa

CdSe based thin film integrated optical sensors

Jan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan Vanfleteren

Evaluation of a 64x64 CdSe TFT addressed ACTFEL display demonstrator

Jan VanfleterenJan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterPatrick De VisschereK SallmenR Graeffe

Failure mechanisms in dielectrics

R Vanden BergheS DemolderM SailleKoenraad AllaertAnita De BruyckerJohan De BaetsAndré Van CalsterJan VanfleterenIgor De RyckeHerbert De Smet et al.

1990

2-MHz clocked LCD drivers on glass

Igor De RyckeAndré Van CalsterJan VanfleterenJohan De BaetsJan DoutreloigneHerbert De SmetPeter Vetter

A1 Journal Article in IEEE JOURNAL OF SOLID-STATE CIRCUITS

A correlation between I/F-noise and short-term drift in poly-CdSe- in thin-film transistors

Jan DoutreloigneJohan De BaetsIgor De RyckeHerbert De SmetAndré Van CalsterJan Vanfleteren

Complementary CdSe In/Ge Cu TFT circuits for integrated display drivers

Jan DoutreloigneHerbert De SmetJohan De BaetsIgor De RyckeAndré Van CalsterJan Vanfleteren

Design of a prototype active matrix CdSe TFT addressed EL display

Jan VanfleterenJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterPatrick De VisschereK SallmenR Graeffe

High-voltage polycrystalline CdSe thin-film transistors

Johan De BaetsJan VanfleterenIgor De RyckeJan DoutreloigneAndré Van CalsterPatrick De Visschere

A1 Journal Article in IEEE TRANSACTIONS ON ELECTRON DEVICES

The electrical performance of a complementary CdSe:In/Ge:Cu thin film transistor technology for flat panel displays

Jan DoutreloigneJohan De BaetsIgor De RyckeHerbert De SmetAndré Van CalsterJan Vanfleteren

A1 Journal Article in SOLID-STATE ELECTRONICS

The influence of low copper-doping concentrations on the recrystallisation process in and the electrical-properties of germanium in Ge-Cu thin-film transistors

Jan DoutreloigneJohan De BaetsIgor De RyckeHerbert De SmetAndré Van CalsterJan Vanfleteren

A1 Journal Article in THIN SOLID FILMS

Thin film transistors for flat screen displays

André Van CalsterJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneJan Vanfleteren

A2 Journal Article in ALTA FREQUENZA : RIVISTA DI ELETTRONICA

1988

On the field effect in polycrystalline CdSe thin-film transistors

André Van CalsterJan VanfleterenI De RyckeJohan De Baets

A1 Journal Article in JOURNAL OF APPLIED PHYSICS

Polycrystalline CdSe films for thin film transistors.

André Van CalsterAlfons VervaetIgor De RyckeJohan De BaetsJan Vanfleteren

A1 Journal Article in JOURNAL OF CRYSTAL GROWTH

1987

A new technology for fast switching-circuits on glass

André Van CalsterIgor DeRyckeAlfons VervaetJohan De BaetsJan Vanfleteren

A1 Journal Article in IEEE ELECTRON DEVICE LETTERS

Polycrystalline CdSe films for Thin Film Transistors.

André Van CalsterAlfons VervaetIgor De RyckeJohan De Baets

1986

Polycrystalline CdSe Films for Thin Film Transistors.

André Van CalsterAlfons VervaetIgor De RyckeJohan De BaetsJ VANFLETEREN

Active matrix with integrated drivers on soda-lime glass using poly-CdSe and poly-Ge. Journal of the SID, Vol. 1/4, pp. 423-428, 1993.

Herbert De SmetJan CaponJohan De BaetsI DE RUCKEJan DoutreloigneAndré Van CalsterJan Vanfleteren

A2 Journal Article

Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.

André Van CalsterJohan De BaetsJan VanfleterenA DRAVETKoenraad AllaertE CORTESK DECKELMANG SCHOLS

CdSe Thin Film Transistors for the Adressing of Liquid Crystal Displays. Voorgesteld op de 'Summer European Liquid Crystal Conference', Vilnius, Lithouwen, 1991.

André Van CalsterJan VanfleterenJan CaponJohan De BaetsI DE RYCKEHerbert De SmetJ DOUTERLOIGNE

Generalised TFT-Model for 4-Quadrant Simulations. Proc. of the 3rd Int. CdSe Workshop, Strasbourg, 1993.

Herbert De SmetJan CaponJohan De BaetsAnn De CubberAndré Van CalsterJan Vanfleteren

Geometric Design of Lensless Photoconductive Cotact-type Image Sensors. Journal of the SID, Vol. 1, Nr. 2, pp. 233-241, 1993.

Jan CaponJohan De BaetsI DE RYCKEHerbert De SmetJan DoutreloigneAndré Van CalsterJan Vanfleteren

A2 Journal Article

On the Physical Properties of a New HVTFT Design. Proc. of the 3rd Int. CdSe Workshop, Strasbourg, 1993.

André Van CalsterJohan De BaetsAnn De CubberJan CaponHerbert De SmetJan Vanfleteren

Thin Film Technologies for High Density Active Matrix Adressed Displays. Proc. of the 9th European Hybrid Microelectronics Conf., pp. 84-90, Nice, 1993.

André Van CalsterJohan De BaetsAnn De CubberHerbert De SmetJan CaponJan VanfleterenJ FARELLM WESTCOTT