Advanced Packaging Pilot Line for Semiconductor System Scaling

Broadband Chip-to-Fiber Coupling Using Polymer Waveguides: An Alignment-Tolerant Interface for Co-Packaged Optics

Co-integration of large-scale photonic and electronic circuits for programmable photonics

Dense integration of photonic and electronic integrated circuits

Doctoral project Ahmed Elmogi

Doctoral project Andres Desmet

Doctoral project Marie-Aline Mattelin

Doctoral project Nivesh Mangal

Integration and Interfacing of Optoelectronics with Femtosecond Laser Microstructuring and 3D-Nanoprinting

Integration of an InP photonic integrated circuit on an electro-optical interposer making use of an expanded optical beam interface

Multi-reticle wafer-scale silicon photonics

Optical injection locking of strained VCSELs for DWDM transmitter

Photonics packaging of chip-scale microcombs

Femtosecond Laser Micromachining of Glass: A Platform for Integrated Optical Sensors

Integration of Visible Laser Diodes on Silicon Nitride

Advanced Packaging Pilot Line for Semiconductor System Scaling

Advanced Packaging Pilot Line for Semiconductor System Scaling

Dense wavelength division multiplexed transmitter based on optical injection locking of strained vertical-cavity surface-emitting lasers

e-POLY

e-POLY

Expanded beam optical interface for high density optical interconnect

GENTOPIC - Ghent Photonic Integrated Circuit Packaging

Photonic System Engineering with Microcombs

The GhenTendon project: monitoring of intratendinous pressures in a non-invasive way.

Flexible electro-photonic integration platform