Code
bof/baf/4y/2024/01/696
Duration
01 January 2024 → 31 December 2025
Funding
Regional and community funding: Special Research Fund
Promotor
Research disciplines
-
Engineering and technology
- Photonics, light and lighting
- Semiconductor devices, nanoelectronics and technology
Keywords
chips
Semiconductor
Advanced Packaging
Project description
This proposal addresses the need for advanced packaging technologies to allow for a plug-and-play “Lego-like” assembly of a
variety of semiconductor chiplets onto a single package, providing several critical capabilities for research in integrated photonics, wireless communication, artificial intelligence, and MedTech.