Research Explorer

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Researcher

Filip Vermeiren

Awards & Distinctions

5 Results

2013

Adhesion test for UTCP structure in humid environment

Kati KokkoTom SterkenFilip VermeirenJan Vanfleteren

Parylene C for hermetic and flexible encapsulation of interconnects and electronic components

Ahmed JarbouiMaarten CauweFilip VermeirenRik VerplanckeHamadi KhemakhemJan VanfleterenMaaike Op de Beeck

2012

Embedding thinned chips in flexible PCBs

Tom SterkenFilip VermeirenPiers TremlettWim ChristiaensJan Vanfleteren

High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Tom SterkenMaaike Op de BeeckFilip VermeirenTom TorfsLiang WangSwarnakamal PriyabadiniKristof DhaenensDieter CuypersJan Vanfleteren

2011

A Reliable and comfortable package for wearable medical devices

Tom SterkenJan VanfleterenFrederick BossuytSteven BrebelsWim ChristiaensThomas VervustMichal JablonskiSheila DunphyFilip VermeirenYung-yu Hsu et al.