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Onderzoeker
Bjorn Vandecasteele
Profiel
Projecten
Publicaties
Activiteiten
Prijzen & Erkenningen
35
Resultaten
2020
Development of an active high-density transverse intrafascicular micro-electrode probe
Rik Verplancke
Maarten Cauwe
David Schaubroeck
Dieter Cuypers
Bjorn Vandecasteele
Lothar Mader
Celine Vanhaverbeke
Marco Ballini
John O’Callaghan
Erkuden Goikoetxea
et al.
A1
Artikel in een tijdschrift
in
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2020
2019
FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
Maaike Op de Beeck
Rik Verplancke
David Schaubroeck
Changzheng Li
Dieter Cuypers
Maarten Cauwe
Bjorn Vandecasteele
Lothar Mader
Celine Vanhaverbeke
John O’Callaghan
et al.
C3
Conferentie
2019
2018
3D multifunctional composites based on large-area stretchable circuit with thermoforming technology
Yang Yang
Thomas Vervust
Sheila Dunphy
Steven Van Put
Bjorn Vandecasteele
Kristof Dhaenens
Lieven Degrendele
Lothar Mader
Linde De Vriese
Tom Martens
et al.
A1
Artikel in een tijdschrift
in
ADVANCED ELECTRONIC MATERIALS
2018
2017
Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers
Bart Plovie
Yang Yang
Joren Guillaume
Sheila Dunphy
Kristof Dhaenens
Steven Van Put
Bjorn Vandecasteele
Thomas Vervust
Frederick Bossuyt
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
ADVANCED ENGINEERING MATERIALS
2017
Thermoplastically Shaped Wearable Medical Devices
Bart Plovie
Sheila Dunphy
Kristof Dhaenens
Steven Van Put
Bjorn Vandecasteele
Frederick Bossuyt
Jan Vanfleteren
C3
Conferentie
2017
Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves
Maaike Op de Beeck
Rik Verplancke
David Schaubroeck
Dieter Cuypers
Maarten Cauwe
Bjorn Vandecasteele
John O'Callaghan
Dries Braeken
Alexandru Andrei
Andrea Firrincieli
et al.
C1
Conferentie
2017
2015
2.5D smart objects using thermoplastic stretchable interconnects
Bart Plovie
Sheila Dunphy
Kristof Dhaenens
Steven Van Put
Bjorn Vandecasteele
Frederick Bossuyt
Jan Vanfleteren
C1
Conferentie
2015
A KA-Band sige Bicmos power amplifier with 24 DBM output power
Ramses Pierco
Guy Torfs
Timothy De Keulenaer
Bjorn Vandecasteele
Jeroen Missinne
Johan Bauwelinck
A1
Artikel in een tijdschrift
in
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
2015
Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects
George Vakanas
O Minho
Biljana Dimcic
Kris Vanstreels
Bjorn Vandecasteele
A1
Artikel in een tijdschrift
in
MICROELECTRONIC ENGINEERING
2015
2014
Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers
Jan Vanfleteren
Imen Chtioui
Bart Plovie
Yang Yang
Frederick Bossuyt
Thomas Vervust
Sheila Dunphy
Bjorn Vandecasteele
P1
Conferentie
2014
Sn whisker evaluations in 3D microbumped structures
George P. Vakanas
Bjorn Vandecasteele
David Schaubroeck
J De Messemaeker
Geert Willems
A1
Artikel in een tijdschrift
in
MICROELECTRONICS RELIABILITY
2014
2013
Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
Maarten Cauwe
Bjorn Vandecasteele
Johan De Baets
Jeroen van den Brand
Roel Kusters
Ashok Sridhar
C1
Conferentie
2013
Integration techniques and applications of thin chips on low cost foil substrates
Daan van den Ende
Ashok Sridhar
Roel Kusters
Jeroen van den Brand
Maarten Cauwe
Bjorn Vandecasteele
C1
Conferentie
2013
Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components
Kamalpreet Kaur
Jeroen Missinne
Bjorn Vandecasteele
Geert Van Steenberge
Sandeep Perinchery
Edsger Smits
Rajesh Mandamparabil
P1
Conferentie
2013
Miniaturized pumps and valves, based on conductive polimer actuators, for lab-on-chip application
M. Hiraoka
P. Fiorini
Bjorn Vandecasteele
H. Tanaka
Tomas Podprocky
Steven Van Put
Maaike Op de Beeck
T. Matsuno
I. Yamashita
P1
Conferentie
2013
2012
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
Maarten Cauwe
Bjorn Vandecasteele
Johan De Baets
Jeroen van den Brand
Roel Kusters
Ashok Sridhar
P1
Conferentie
2012
Adhesive bonding by SU-8 transfer for assembling microfluidic devices
Pietro Salvo
Rik Verplancke
Frederick Bossuyt
Daniel Latta
Bjorn Vandecasteele
Chengxun Liu
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
MICROFLUIDICS AND NANOFLUIDICS
2012
An approach to produce a stack of photo definable polyimide based flat UTCPs
Swarnakamal Priyabadini
Tom Sterken
Liang Wang
Kristof Dhaenens
Bjorn Vandecasteele
Steven Van Put
Andreas Erik Petersen
Jan Vanfleteren
P1
Conferentie
2012
2011
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
Maarten Cauwe
Bjorn Vandecasteele
An Gielen
Johan De Baets
Jeroen van den Brand
Roel Kusters
C1
Conferentie
2011
2008
Interconnecting drivers to flexible displays
Jonathan Govaerts
Bjorn Vandecasteele
Jan Vanfleteren
A1
Artikel in een tijdschrift
in
JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY
2008
2007
Embedding of thinned chips in plastic substrates
Bjorn Vandecasteele
Jonathan Govaerts
Jan Vanfleteren
C1
Conferentie
2007
2006
A flexible polyimide based circuit for rapid heating of small objects
Bjorn Vandecasteele
Kristof Dhaenens
Wim Christiaens
Lieven Degrendele
M STEEL
A VAN LIERE
Jan Vanfleteren
C1
Conferentie
2006
2005
Advanced Technologies in Fabrication and Interconnection of Flexible Displays and Substrates
Tom Bert
Jan Vanfleteren
Bjorn Vandecasteele
Stefaan Maeyaert
Jan Doutreloigne
Jonathan Govaerts
Herbert De Smet
André Van Calster
C1
Conferentie
2005
Lead-free flip chip: a comparison between lead-free solder and adhesives
Bjorn Vandecasteele
Jan Vanfleteren
D MANESSIS
A OSTMANN
H HAGEDORN
J WIESE
C1
Conferentie
2005
2004
Low temperature flip chip attachment for flexible display applications
Bjorn Vandecasteele
J MAATTANEN
Tomas Podprocky
Jan Vanfleteren
C1
Conferentie
2004
Tiheiden joustaville alustoille tehtyjen kääntösiruliitosten testausohjelma ja tulokset - reliability results of high density flip chip on flex assemblies
J MAATTANEN
Bjorn Vandecasteele
Jan Vanfleteren
Y DE MAQUILLE
C1
Conferentie
2004
2003
Comparison of different flex materials in high density flip chip on flex applications
P PALM
J MAATTANEN
Y DE MAQUILLE
A PICAULT
Jan Vanfleteren
Bjorn Vandecasteele
A1
Artikel in een tijdschrift
in
MICROELECTRONICS RELIABILITY
2003
Integration of Thick Film resistors in a multilayer structure
Tomas Podprocky
Bjorn Vandecasteele
Johan De Baets
André Van Calster
C1
Conferentie
2003
Integration of thick film resitors in a multilayer structure
Tomas Podprocky
Bjorn Vandecasteele
Johan De Baets
André Van Calster
J BANSKY
P1
Conferentie
2003
Low temperature flip chip with adhesives on PES
Bjorn Vandecasteele
Tomas Podprocky
Jan Vanfleteren
J MAATTANEN
C1
Conferentie
2003
Results of a high density flip chip on flex reliability test program
Bjorn Vandecasteele
Jan Vanfleteren
J MAATTANEN
T LAITINEN
Y DE MAQUILLE
P1
Conferentie
2003
Thick film inductors for RF applications
Tomas Podprocky
Bjorn Vandecasteele
Johan De Baets
André Van Calster
C1
Conferentie
2003
2002
Low temperature flip-chip process using ICA and NCA (Isotropically and non-conductive adhesive) for flexible displays application
Jan Vanfleteren
Bjorn Vandecasteele
Tomas Podprocky
P1
Conferentie
2002
Reduced temperature flip-chip technologies on flexible display substrates using adhesives
Jan Vanfleteren
Bjorn Vandecasteele
S RAEVENS
J MAATTANEN
P PERTTULA
P1
Conferentie
2002
2001
Reliability of different flex materials in high density flip chip on flex applications
P PALM
J MAATTANEN
Y DE MAQUILLE
A PICAULT
Jan Vanfleteren
Bjorn Vandecasteele
P1
Conferentie
2001