Research Explorer

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Researcher

Bjorn Vandecasteele

Awards & Distinctions

35 Results

2020

Development of an active high-density transverse intrafascicular micro-electrode probe

Rik VerplanckeMaarten CauweDavid SchaubroeckDieter CuypersBjorn VandecasteeleLothar MaderCeline VanhaverbekeMarco BalliniJohn O’CallaghanErkuden Goikoetxea et al.

A1 Journal Article in JOURNAL OF MICROMECHANICS AND MICROENGINEERING

2019

FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers

Maaike Op de BeeckRik VerplanckeDavid SchaubroeckChangzheng LiDieter CuypersMaarten CauweBjorn VandecasteeleLothar MaderCeline VanhaverbekeJohn O’Callaghan et al.

2018

3D multifunctional composites based on large-area stretchable circuit with thermoforming technology

Yang YangThomas VervustSheila DunphySteven Van PutBjorn VandecasteeleKristof DhaenensLieven DegrendeleLothar MaderLinde De VrieseTom Martens et al.

A1 Journal Article in ADVANCED ELECTRONIC MATERIALS

2017

Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers

Bart PlovieYang YangJoren GuillaumeSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleThomas VervustFrederick BossuytJan Vanfleteren

A1 Journal Article in ADVANCED ENGINEERING MATERIALS

Thermoplastically Shaped Wearable Medical Devices

Bart PlovieSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleFrederick BossuytJan Vanfleteren

Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves

Maaike Op de BeeckRik VerplanckeDavid SchaubroeckDieter CuypersMaarten CauweBjorn VandecasteeleJohn O'CallaghanDries BraekenAlexandru AndreiAndrea Firrincieli et al.

2015

2.5D smart objects using thermoplastic stretchable interconnects

Bart PlovieSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleFrederick BossuytJan Vanfleteren

A KA-Band sige Bicmos power amplifier with 24 DBM output power

Ramses PiercoGuy TorfsTimothy De KeulenaerBjorn VandecasteeleJeroen MissinneJohan Bauwelinck

A1 Journal Article in MICROWAVE AND OPTICAL TECHNOLOGY LETTERS

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

George VakanasO MinhoBiljana DimcicKris VanstreelsBjorn Vandecasteele

A1 Journal Article in MICROELECTRONIC ENGINEERING

2014

Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers

Jan VanfleterenImen ChtiouiBart PlovieYang YangFrederick BossuytThomas VervustSheila DunphyBjorn Vandecasteele

Sn whisker evaluations in 3D microbumped structures

George P. VakanasBjorn VandecasteeleDavid SchaubroeckJ De MessemaekerGeert Willems

A1 Journal Article in MICROELECTRONICS RELIABILITY

2013

Active and passive component embedding into low-cost plastic substrates aimed at smart system applications

Maarten CauweBjorn VandecasteeleJohan De BaetsJeroen van den BrandRoel KustersAshok Sridhar

Integration techniques and applications of thin chips on low cost foil substrates

Daan van den EndeAshok SridharRoel KustersJeroen van den BrandMaarten CauweBjorn Vandecasteele

Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic components

Kamalpreet KaurJeroen MissinneBjorn VandecasteeleGeert Van SteenbergeSandeep PerincheryEdsger SmitsRajesh Mandamparabil

Miniaturized pumps and valves, based on conductive polimer actuators, for lab-on-chip application

M. HiraokaP. FioriniBjorn VandecasteeleH. TanakaTomas PodprockySteven Van PutMaaike Op de BeeckT. MatsunoI. Yamashita

2012

A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

Maarten CauweBjorn VandecasteeleJohan De BaetsJeroen van den BrandRoel KustersAshok Sridhar

Adhesive bonding by SU-8 transfer for assembling microfluidic devices

Pietro SalvoRik VerplanckeFrederick BossuytDaniel LattaBjorn VandecasteeleChengxun LiuJan Vanfleteren

A1 Journal Article in MICROFLUIDICS AND NANOFLUIDICS

An approach to produce a stack of photo definable polyimide based flat UTCPs

Swarnakamal PriyabadiniTom SterkenLiang WangKristof DhaenensBjorn VandecasteeleSteven Van PutAndreas Erik PetersenJan Vanfleteren

2011

Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils

Maarten CauweBjorn VandecasteeleAn GielenJohan De BaetsJeroen van den BrandRoel Kusters

2008

Interconnecting drivers to flexible displays

Jonathan GovaertsBjorn VandecasteeleJan Vanfleteren

A1 Journal Article in JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY

2007

Embedding of thinned chips in plastic substrates

Bjorn VandecasteeleJonathan GovaertsJan Vanfleteren

2006

A flexible polyimide based circuit for rapid heating of small objects

Bjorn VandecasteeleKristof DhaenensWim ChristiaensLieven DegrendeleM STEELA VAN LIEREJan Vanfleteren

2005

Advanced Technologies in Fabrication and Interconnection of Flexible Displays and Substrates

Tom BertJan VanfleterenBjorn VandecasteeleStefaan MaeyaertJan DoutreloigneJonathan GovaertsHerbert De SmetAndré Van Calster

Lead-free flip chip: a comparison between lead-free solder and adhesives

Bjorn VandecasteeleJan VanfleterenD MANESSISA OSTMANNH HAGEDORNJ WIESE

2004

Low temperature flip chip attachment for flexible display applications

Bjorn VandecasteeleJ MAATTANENTomas PodprockyJan Vanfleteren

Tiheiden joustaville alustoille tehtyjen kääntösiruliitosten testausohjelma ja tulokset - reliability results of high density flip chip on flex assemblies

J MAATTANENBjorn VandecasteeleJan VanfleterenY DE MAQUILLE

2003

Comparison of different flex materials in high density flip chip on flex applications

P PALMJ MAATTANENY DE MAQUILLEA PICAULTJan VanfleterenBjorn Vandecasteele

A1 Journal Article in MICROELECTRONICS RELIABILITY

Integration of Thick Film resistors in a multilayer structure

Tomas PodprockyBjorn VandecasteeleJohan De BaetsAndré Van Calster

Integration of thick film resitors in a multilayer structure

Tomas PodprockyBjorn VandecasteeleJohan De BaetsAndré Van CalsterJ BANSKY

Low temperature flip chip with adhesives on PES

Bjorn VandecasteeleTomas PodprockyJan VanfleterenJ MAATTANEN

Results of a high density flip chip on flex reliability test program

Bjorn VandecasteeleJan VanfleterenJ MAATTANENT LAITINENY DE MAQUILLE

Thick film inductors for RF applications

Tomas PodprockyBjorn VandecasteeleJohan De BaetsAndré Van Calster

2002

Low temperature flip-chip process using ICA and NCA (Isotropically and non-conductive adhesive) for flexible displays application

Jan VanfleterenBjorn VandecasteeleTomas Podprocky

Reduced temperature flip-chip technologies on flexible display substrates using adhesives

Jan VanfleterenBjorn VandecasteeleS RAEVENSJ MAATTANENP PERTTULA

2001

Reliability of different flex materials in high density flip chip on flex applications

P PALMJ MAATTANENY DE MAQUILLEA PICAULTJan VanfleterenBjorn Vandecasteele