The goal of this project is to develop the spray coating of photoresist, ultra-thin DVS-BCB adhesive bonding layers and other advanced polymers on 200 mm Si wafers or small samples comprising photonic or electronic integrated circuits (ICs), or MEMS. This will enable the realization of heterogeneous semiconductor systems-on-chip for application in optical transceivers, smart sensors and advanced electronic integrated circuits (analogue frontends), by means of micro-transfer printing technology. The main applications are the integration of III-V semiconductor photonic (electronic) components on silicon photonic (electronic) ICs, but the integration of other material systems of great importance for photonics (electro-optic materials, magneto-optic materials) will be envisioned as well, all enabled by spray coating and micro-transfer printing. The spray coating is a key technology to enable such heterogeneous systems-on-chip as it is the only technique that allows a uniform conformal coating of thin polymer layers on high-topography wafer surfaces, which is essential for micro-transfer printing. Next to this the use of the tool for bio-electronic applications (specifically neural interfaces) will be evaluated, a market with a large growth potential. Specifically the spray coating of semiconducting and conducting polymers on conformable substrates will be developed.