Research Explorer

Project

Ultrathin flexible hermetic encapsulation of mechanical sensors for long term electronic implants
Code
01CD01125
Duration
01 September 2025 → 31 December 2025
Funding
Regional and community funding: Special Research Fund
Research disciplines
  • Engineering and technology
    • Nanomanufacturing
    • Biosensors
    • Micro- and nanoelectromechanical systems
Keywords
Implantable medical devices PMUT flexible coating Hermetic encapsulation
 
Project description
 A biocompatible hermetic encapsulation method will be developed for piezoelectric micromachined ultrasonic transducers (PMUTs) for biomedical implants, using highly flexible materials to ensure good PMUT performance. Soft polymer layers (Parylene) combined with triple ALD layers (HfO2/Al2O3/HfO2) will ensure long-term hermetic sealing, enabling PMUT applications in ultrasound imaging, and wireless data and power transfer between the implant and the external world.