doctoraat Murad Redzheb Fundamental research on the mechanical stability of ultra low-k PMO films and pore sealing of low-k films by deposition of organic bridged silsequioxane barriers IMEC

Mesoporous organosilica films that contain organic bridges (so called PMO materials) are one of the most
promising ultra low-k materials because of predicted improvement of mechanical properties and chemical
stab!llty. These materials demonstrate the possibility of scaling the dielectric constant values below than 2.0
without crit!caf degradation of mechanical stability as it happens In PECVD materials. Further scaling of the
dielectric constant requires fundamental understanding of correlation of deposition conditions with the fllms
properties.