Chiplet-based architectures are revolutionizing semiconductor design by enabling modular, high-performance systems with improved scalability and cost efficiency. However, achieving high-speed, reliable communication between chiplets remains a significant challenge. This research aims to characterize chiplet interconnects by identifying key factors affecting link performance, including speed, reliability, and energy efficiency. To overcome these challenges, an on-chip system for interconnect impedance measurement, crosstalk quantification, and signal integrity assessment will be developed. A novel measurement methodology will be implemented to extract resistance, inductance, capacitance, and conductance (RLCG), along with mutual inductance (Lm) and mutual capacitance (Cm), directly on-chip. Additionally, multi-stage chiplet interconnect architectures will be analyzed, comparing direct die-to-die connections, series jumps, and active interposers to determine the most efficient topology for high-bandwidth applications. A key objective is the design of a high-speed, low-power, sub-micron pitch wireline transceiver targeting 64 Gbps data rates. The transceiver will be optimized for low-latency, energy-efficient signal transmission across varying interconnect configurations. The outcomes of this research will contribute to optimizing chiplet integration for next-generation computing systems.