MEMSStar's ORBIS™ ALPHA system is a compact, self-contained tool designed for silicon etching. It features integrated process monitoring and endpoint control, ensuring high selectivity and uniformity. The system uses vapor phase dry release etching with xenon difluoride (XeF2), which is highly selective to materials like SiO2 and Si3N4. This allows for large undercuts of structures without degradation in etch rate, making it suitable for etching various forms of silicon.