Infrastructure

Precision Wafer Cleaving System

Type
Equipment
Acronym
Lattice
Code
APP/00238
Date of commissioning
01 January 2024 → …
Research disciplines
  • Natural sciences
    • Photonics, optoelectronics and optical communications
Keywords
manual cleaving precision cleaving wafer cleaving
Brand Name/manufacturer
PELCO LatticeAx 225
Other information
 
Description

The PELCO LatticeAx 225 is a precision cleaving system used to accurately downsize wafers and substrates.