Type
Equipment
Acronym
ICP3-Si
Code
APP/00229
Date of commissioning
01 July 2021 → …
Research disciplines
-
Natural sciences
- Photonics, optoelectronics and optical communications
Keywords
DRIE
low-temperature etching
deep silicon etching
cryo etching
Brand Name/manufacturer
Oxford PlasmaPro 100 Cobra
Other information
Description
Inductively Coupled Plasma (ICP) etching system for the etching of diverse materials including silicon, silicon oxide, silicon nitride, germanium, ...- Cryo-option- Mixed-gas process (SF6, CHF3)- Bosch DSiE process