Type
Equipment
Acronym
EVG bonder
Code
APP/00300
Date of commissioning
01 January 2011 → …
Research disciplines
-
Engineering and technology
- Semiconductor devices, nanoelectronics and technology
Keywords
substrate alignment
wafer bonding
wafer-level packaging
Brand Name/manufacturer
EVG 501
Other information
Description
The EVG 501 is a semi-automated wafer bonder for substrates up to 200 mm. It supports anodic, eutectic, thermocompression, and direct bonding.