Type
Equipment
Acronym
Logitech bonder
Code
APP/00299
Date of commissioning
01 January 2008 → …
Research disciplines
-
Engineering and technology
- Semiconductor devices, nanoelectronics and technology
Keywords
substrate assembly
pressure bonding
wafer bonding
vacuum bonding
Brand Name/manufacturer
Logitech WSB2
Other information
Description
A wafer substrate bonding unit that supports both vacuum and pressure bonding, with programmable control over temperature and applied load.