Type
Equipment
Acronym
Wafer dicer
Code
APP/00302
Date of commissioning
01 January 2012 → …
Research disciplines
-
Engineering and technology
- Semiconductor devices, nanoelectronics and technology
Keywords
automated saw
wafer dicing
substrate cutting
Brand Name/manufacturer
Disco DAD322
Other information
Description
The Disco DAD322 is a fully automated dicing saw to cut materials such as silicon wafers and glass substrates.