Type
Equipment
Acronym
Reflow oven
Code
APP/00292
Date of commissioning
01 January 2002 → …
Research disciplines
-
Engineering and technology
- Semiconductor devices, nanoelectronics and technology
Keywords
reflow profile
soldering
inert atmosphere
PCB assembly
vapour phase reflow
Brand Name/manufacturer
IBL SLC300
Other information
Description
Reflow oven for solder pastes with a programmable temperature profile using the vapour phase of an inert liquid for the transfer of heat.