The Solstice® S8 automated electroplating systems are high-speed, fully-automated, 8-chambered tool designed for electrochemical deposition (ECD) as well as surface preparation wet processing – specifically for ≤200mm wafers. Our tool enables wafer cleaning (SC-1,SC-2), electroplating of Au, Cu, Sn an Ni, as well as seed layer etch and metal lift-off.