Type
Equipment
Acronym
CB6L bonder
Code
APP/00266
Date of commissioning
01 January 2008 → …
Research disciplines
-
Natural sciences
- Photonics, optoelectronics and optical communications
Keywords
thermal compression bonding
wafer bonding
heterogeneous integration
bond aligner
Brand Name/manufacturer
Suss MicroTec CB6L
Other information
Description
Wafer bonder for samples and substrates up to 150mm. Compatible with thermal bonding and pressure bonding. Aligned bonding fixtures available. Allows creating heterogeneous substrates containing diverse materials not otherwise integrable.