The Vapor Phase Etcher is used for etching silicon dioxide in microfabrication. It helps release micro-electromechanical systems (MEMS), which can be challenging due to thin gaps and fragile structures that can be damaged by liquid HF acid. The etching process uses HF acid vapor, allowing control over the wafer’s water content without direct liquid contact. This enables safe MEMS release, with typical etch rates of 4-10 µm/hour.