Research Explorer

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Researcher

Wim Christiaens

Awards & Distinctions

41 Results

2011

3D-stacking of UTCPs as a module miniaturization technology

Swarnakamal PriyabadiniAn GielenKristof DhaenensWim ChristiaensSteven Van PutGerhard KunkelAnders Erik PetersenJan Vanfleteren

A Reliable and comfortable package for wearable medical devices

Tom SterkenJan VanfleterenFrederick BossuytSteven BrebelsWim ChristiaensThomas VervustMichal JablonskiSheila DunphyFilip VermeirenYung-yu Hsu et al.

Design and implementation of flexible and stretchable systems

Mario GonzalezBart VandeveldeWim ChristiaensYung-Yu HsuFrançois IkerFrederick BossuytJan VanfleterenOlaf van der SluisPHM Timmermans

A1 Journal Article in MICROELECTRONICS RELIABILITY

System-in-foil technology

Andreas DietzelJeroen van den BrandJan VanfleterenWim ChristiaensErwin BosmanJohan De Baets

Bookchapter in Ultra-thin chip technology and applications

2010

Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Jonathan GovaertsErwin BosmanWim ChristiaensJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON ADVANCED PACKAGING

Module miniaturization by ultra thin package stacking

Thomas LoeherDavid SchuetzeWim ChristiaensKristof DhaenensSwarnakamal PriyabadiniAndreas OstmannJan Vanfleteren

Thermo-mechanical analysis of flexible and stretchable systems

Mario GonzalezBart VandeveldeWim ChristiaensYung Yu HsuFrancois IkerFrederick BossuytJan VanfleterenOlaf Van der SluisPieter Timmermans

UTCP: a novel polyimide-based ultra-thin chip packaging technology

Wim ChristiaensErwin BosmanJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

2009

3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems

Wim ChristiaensTom TorfsWim HuwelChris Van HoofJan Vanfleteren

3D Integration of ultra-thin functional devices inside standard multilayer flex laminates

Wim ChristiaensTom TorfsWim HuwelChris Van HoofJan Vanfleteren

Embedded chips redefine miniaturization

Els PartonWim ChristiaensJan Vanfleteren

A2 Journal Article in PRINTED CIRCUIT DESIGN & FAB

Fabrication processes for embedding thin chips in flat flexible substrates

Jonathan GovaertsWim ChristiaensErwin BosmanJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON ADVANCED PACKAGING

Flexible wireless biopotential system with embedded ultra-thin chip

Tom TorfsWim ChristiaensJan VanfleterenWim HuwelWim PerduRF YaziciogluSteven BrebelsChris Van Hoof

Improved passive-matrix multiplexability with a modular display and UTCP technology

Pieter BauwensAnn MontéWim ChristiaensJan DoutreloigneJan Vanfleteren

A1 Journal Article in DISPLAYS

Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection

Jonathan GovaertsWim ChristiaensJan Vanfleteren

2008

Active optical links embedded in flexible substrates

Erwin BosmanGeert Van SteenbergeWim ChristiaensNina HendrickxJan VanfleterenPeter Van Daele

Embedding and assembly of ultrathin chips in multilayer flex boards

Wim ChristiaensThomas LoeherBarbare PahlMichael FeilBart VandeveldeJan Vanfleteren

A1 Journal Article in CIRCUIT WORLD

Flexible embedded active optical link

Erwin BosmanGeert Van SteenbergeNina HendrickxWim ChristiaensJan VanfleterenPeter Van Daele

Functionality and Reliability Testing of Bendable Ultrathin Chip Packages

Wim ChristiaensTom TorfsWim HuwelJan Vanfleteren

Multiple chip integration for flat flexible electronics

Jonathan GovaertsWim ChristiaensErwin BosmanJan Vanfleteren

2007

Embedding of active components in multilayer flex boards

Wim ChristiaensT LOEHERM FEILB VANDEVELDEJan Vanfleteren

Embedding of chips in flex: a global optimisation from thermal, mechanical and electrical RF perspective

B VANDEVELDEL CHENS BREBELSWim ChristiaensJan Vanfleteren

Embedding of optical interconnections in flexible electronics

Erwin BosmanGeert Van SteenbergePeter GeerinckWim ChristiaensJan VanfleterenPeter Van Daele

Flexible polyimide based ultra-thin chip package (UTCP)

Wim ChristiaensErwin BosmanWim HuwelWim PerduJan Vanfleteren

Integration of thin flexible RF structures into flexible PCB

Wim ChristiaensH BURKARDJ LINKJan Vanfleteren

Multimode optical interconnections embedded in flexible electronics

Erwin BosmanGeert Van SteenbergeNina HendrickxPeter GeerinckWim ChristiaensJan VanfleterenPeter Van Daele

Polyimide based embedding technology for RF structures and active components

Wim ChristiaensB VANDEVELDES BREBELSJan Vanfleteren

2006

(Flat) Ultra-thin chip package

Wim ChristiaensBart VandeveldeJan Vanfleteren

A flexible polyimide based circuit for rapid heating of small objects

Bjorn VandecasteeleKristof DhaenensWim ChristiaensLieven DegrendeleM STEELA VAN LIEREJan Vanfleteren

Embedding active components as a 3D packaging solution

Maarten CauweWim ChristiaensJan VanfleterenJohan De Baets

A2 Journal Article in Advancing Microelectronics

Embedding of chips in flex and rigid substrates: impact on thermal and mechanical performance

B VANDEVELDEC CHENJ SOMMERWim ChristiaensB VANDECASTEELEJ VANFLETERENR REHTINIEMIA ARSLAN

New packaging concept for ultra-thin chips

Els PartonWim Christiaens

A2 Journal Article in ADVANCED PACKAGING

Optical connections on flexible substrates

Erwin BosmanPeter GeerinckWim ChristiaensGeert Van SteenbergeJan VanfleterenPeter Van Daele

Optical interconnections embedded in flexible substrates

Erwin BosmanWim ChristiaensPeter GeerinckGeert Van SteenbergeJan VanfleterenPeter Van Daele

Optical interconnections embedded in flexible substrates

Erwin BosmanWim ChristiaensPeter GeerinckGeert Van SteenbergeJan VanfleterenPeter Van Daele

UTCP: 60 µm thick bendable package

Wim ChristiaensBart VandeveldeErwin BosmanJan Vanfleteren

Ultra-thin chip package (UTCP) for flexible electronics applications

Wim ChristiaensBart VandeveldeJan Vanfleteren

Ultra-thin chip package using embedding in spin-on polyimides

Wim ChristiaensErwin BosmanJan Vanfleteren

A4 Journal Article in GOOD-DIE NEWSLETTER

Ultra-thin chip package using embedding in spin-on polyimides

Wim ChristiaensErwin BosmanJan Vanfleteren

2005

Embedded ultra-thin chips in flex

Wim ChristiaensMichael FeilThomas LoeherJan Vanfleteren

Flexible embedded components for polyimide substrate

Wim Christiaens