Manage settings
MENU
About this site
In het Nederlands
Home
Researchers
Projects
Organisations
Publications
Contact
Research Explorer
Your browser does not support JavaScript or JavaScript is not enabled. Without JavaScript some functions of this webapplication may be disabled or cause error messages. To enable JavaScript, please consult the manual of your browser or contact your system administrator.
Researcher
Swarnakamal Priyabadini
Profile
Projects
Publications
Activities
8
Results
2014
High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages
Swarnakamal Priyabadini
Tom Sterken
Maarten Cauwe
Luc Van Hoorebeke
Jan Vanfleteren
A1
Journal Article
in
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2014
2013
3D stacking of ultrathin chip packages: an innovative packaging and interconnection technology
Swarnakamal Priyabadini
Tom Sterken
Luc Van Hoorebeke
Jan Vanfleteren
A1
Journal Article
in
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2013
3D-stacking of ultra-thin chips and chip packages
Swarnakamal Priyabadini
Jan Vanfleteren
Tom Sterken
Dissertation
2013
Photo-definable polyimide-based flat UTCP technology for 3D-stacking application
Swarnakamal Priyabadini
Tom Sterken
Maaike Op de Beeck
Jan Vanfleteren
C1
Conference
2013
2012
An approach to produce a stack of photo definable polyimide based flat UTCPs
Swarnakamal Priyabadini
Tom Sterken
Liang Wang
Kristof Dhaenens
Bjorn Vandecasteele
Steven Van Put
Jan Vanfleteren
P1
Conference
2012
High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
Tom Sterken
Maaike Op de Beeck
Filip Vermeiren
Liang Wang
Swarnakamal Priyabadini
Kristof Dhaenens
Dieter Cuypers
Jan Vanfleteren
C1
Conference
2012
2011
3D-stacking of UTCPs as a module miniaturization technology
Swarnakamal Priyabadini
An Gielen
Kristof Dhaenens
Wim Christiaens
Steven Van Put
Jan Vanfleteren
C1
Conference
2011
2010
Module miniaturization by ultra thin package stacking
Wim Christiaens
Kristof Dhaenens
Swarnakamal Priyabadini
Jan Vanfleteren
C1
Conference
2010