Research Explorer

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Researcher

Swarnakamal Priyabadini

8 Results

2014

High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages

Swarnakamal PriyabadiniTom SterkenMaarten CauweLuc Van HoorebekeJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

2013

3D stacking of ultrathin chip packages: an innovative packaging and interconnection technology

Swarnakamal PriyabadiniTom SterkenLuc Van HoorebekeJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

3D-stacking of ultra-thin chips and chip packages

Swarnakamal PriyabadiniJan VanfleterenTom Sterken

Photo-definable polyimide-based flat UTCP technology for 3D-stacking application

Swarnakamal PriyabadiniTom SterkenMaaike Op de BeeckJan Vanfleteren

2012

An approach to produce a stack of photo definable polyimide based flat UTCPs

Swarnakamal PriyabadiniTom SterkenLiang WangKristof DhaenensBjorn VandecasteeleSteven Van PutJan Vanfleteren

High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Tom SterkenMaaike Op de BeeckFilip VermeirenLiang WangSwarnakamal PriyabadiniKristof DhaenensDieter CuypersJan Vanfleteren

2011

3D-stacking of UTCPs as a module miniaturization technology

Swarnakamal PriyabadiniAn GielenKristof DhaenensWim ChristiaensSteven Van PutJan Vanfleteren

2010

Module miniaturization by ultra thin package stacking

Wim ChristiaensKristof DhaenensSwarnakamal PriyabadiniJan Vanfleteren