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Patents
Philip Ekkels
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Patents
Inventor of
Method for Bonding Thin Semiconductor Chips to a Substrate
Granted patent(s)
EP3333882
( 04 August 2020 )
Granted patent(s)
EP3333882
( 04 August 2020 )
US10186447
( 21 October 2019 )
Applicant(s)
Ghent University
Imec
Ghent University inventors
Philip Ekkels
Other inventors
Tom Sterken
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