Research Explorer

Your browser does not support JavaScript or JavaScript is not enabled. Without JavaScript some functions of this webapplication may be disabled or cause error messages. To enable JavaScript, please consult the manual of your browser or contact your system administrator.

Researcher

Maarten Cauwe

Awards & Distinctions

69 Results

2023

Advanced PCB technologies for space and their assessment using up-to-date standards

Stan HeltzelMaarten CauweJoe BennettThomas Rohr

A2 Journal Article in CEAS SPACE JOURNAL

Challenges in introducing high-density interconnect technology in printed circuit boards for space applications

Maarten CauweBart VandeveldeChinmay NawghaneMarnix Van De SlyekeAlexia CoulonStan Heltzel

A2 Journal Article in CEAS SPACE JOURNAL

2021

Cost-effective high-performance air-filled SIW antenna array for the global 5G 26 GHz and 28 GHz bands

Igor Lima de PaulaSam LemeyDries BosmanQuinten Van den BrandeOlivier CaytanJoris LambrechtMaarten CauweGuy TorfsHendrik Rogier

A1 Journal Article in IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS

2020

Accelerated hermeticity testing of biocompatible moisture barriers used for the encapsulation of implantable medical devices

Changzheng LiMaarten CauweLothar MaderDavid SchaubroeckMaaike Op de Beeck

A1 Journal Article in COATINGS

Development of an active high-density transverse intrafascicular micro-electrode probe

Rik VerplanckeMaarten CauweDavid SchaubroeckDieter CuypersBjorn VandecasteeleLothar MaderCeline VanhaverbekeMarco BalliniJohn O’CallaghanErkuden Goikoetxea et al.

A1 Journal Article in JOURNAL OF MICROMECHANICS AND MICROENGINEERING

High-density interconnect technology assessment of printed circuit boards for space applications

Maarten CauweBart VandeveldeChinmay NawghaneMarnix Van De SlyekeErwin BosmanJoachim VerheggeAlexia CoulonStan Heltzel

A2 Journal Article in JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING

Study of ALD barrier layers for the embedding of electronic and opto-electronic components in a smart microsystem in direct contact with the human body

Celine VanhaverbekeHerbert De SmetMaarten Cauwe

The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation

David SchaubroeckChangzheng LiRik VerplanckeDieter CuypersMaarten CauweMaaike Op de Beeck

2019

Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3

Celine VanhaverbekeMaarten CauweArno StockmanMaaike Op de BeeckHerbert De Smet

A1 Journal Article in THIN SOLID FILMS

Dual-band (28,38) GHz coupled quarter-mode substrate-integrated waveguide antenna array for next-generation wireless systems

Thomas DeckmynMaarten CauweDries Vande GinsteHendrik RogierSam Agneessens

A1 Journal Article in IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION

FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers

Maaike Op de BeeckRik VerplanckeDavid SchaubroeckChangzheng LiDieter CuypersMaarten CauweBjorn VandecasteeleLothar MaderCeline VanhaverbekeJohn O’Callaghan et al.

Ultra-long-term reliable encapsulation using an atomic layer deposited Hfo2/Al2o3/Hfo2 triple-interlayer for biomedical implants

Changzheng LiMaarten CauweYang YangDavid SchaubroeckLothar MaderMaaike Op de Beeck

A1 Journal Article in COATINGS

2018

A PCB-embedding scheme for LCP ribbon waveguide at D-band

Joren VaesIlja OcketWan-Ling TsaiMaarten CauwePatrick ReynaertBart Nauwelaers

Novel broadband transition for rectangular dielectric waveguide to planar circuit board at D band

Wan-Ling TsaiIlja OcketJoren VaesMaarten CauwePatrick ReynaertBart Nauwelaers

2017

A modular and interactive OLED-based lighting system

Ann MontéJurica KundrataJeroen SchramMaarten CauweAdrijan BaricJan Doutreloigne

A1 Journal Article in LEUKOS

A novel 60 GHz wideband coupled half-mode/quarter-mode substrate integrated waveguide antenna

Thomas DeckmynSam AgneessensAd C. F. ReniersA. Bart SmoldersMaarten CauweDries Vande GinsteHendrik Rogier

A1 Journal Article in IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION

Accelerated hermeticity testing of biocompatible moisture barriers used for encapsulation of implantable medical devices

Changzheng LiLothar MaderCeline VanhaverbekeDavid SchaubroeckMaarten CauweMaaike Op de Beeck

Intraneural active probe for bidirectional peripheral nerve interface

Marco BalliniJoonsung BaeNicola MarroccoRik VerplanckeDavid SchaubroeckDieter CuypersMaarten CauweJohn O'CallaghanAhmed FahmyNima Maghari et al.

One-Time Deformable Thermoplastic Devices Based on Flexible Circuit Board Technology

Bart PlovieMaarten CauweFrederick BossuytJan Vanfleteren

Passive component embedding in printed circuit boards for space applications

Maarten CauweJohan De Baets

Polyimide-ald-polyimide layers as hermetic encapsulant for implants

David SchaubroeckRik VerplanckeMaarten CauweDieter CuypersKim BaumansMaaike Op de Beeck

Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves

Maaike Op de BeeckRik VerplanckeDavid SchaubroeckDieter CuypersMaarten CauweBjorn VandecasteeleJohn O'CallaghanDries BraekenAlexandru AndreiAndrea Firrincieli et al.

2016

How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

Bart VandeveldeLieven DegrendeleMaarten CauweBart AllaertRalf LauwaertGeert Willems

Hybrid integration on low-cost flex foils using photonic flash soldiering

Saeed Khoshfetrat PakazadMarco BarinkGari ArutinovRob HendriksRoel KustersMaarten CauweJeroen van den Brand

Millimeter wave planar transition from plastic rectangular waveguide to 1 mm coax

Ilja OcketMaarten CauweBart Nauwelaers

PASSIVE COMPONENT EMBEDDING IN PRINTED CIRCUIT BOARDS FOR SPACE APPLICATIONS

Maarten CauweGerhard SchmidSteven De CuyperDenis Lacombe

Passive component embedding in printed circuit boards for space applications

Maarten CauweJohan De BaetsGerhard SchmidChristian GallerJohan De HertSteven De CuyperDenis Lacombe

Polymer-based encapsulation materials with optimized diffusion barrier properties for flexible hermetic medical electronics

Maaike Op de BeeckDavid SchaubroeckMaarten Cauwe

Stretchable passive matrix LED display with thin-film based interconnects

Rik VerplanckeMaarten CauweSteven Van PutEdsger SmitsRoel KustersGert Van HeckJeroen Van den BrandMitsuhiro MurataHideki OhmaeYoshihiro Tomita et al.

2015

A conformable active matrix LED display

Ashutosh TripathiEdsger SmitsJan-Laurens van der SteenMaarten CauweRik VerplanckeKris MynyJoris MaasRoel KustersSami SabikMitsuhiro Murata et al.

Flexible and stretchable electronics for wearable health devices

Jeroen van den BrandMargreet de KokMark KoetseMaarten CauweRik VerplanckeFrederick BossuytMichal JablonskiJan Vanfleteren

A1 Journal Article in SOLID-STATE ELECTRONICS

Microwave heater at 20 GHz for nanoliter scale digital microfluidics

Tomislav MarkovicSong LiuPawel BarmutaIlja OcketMaarten CauweDominique SchreursBart Nauwelaers

Sensitivity analysis of broadband on-wafer dielectric spectroscopy of yeast cell suspensions up to 110 GHz

S LiuI OcketMaarten CauweD SchreursB Nauwelaers

A1 Journal Article in IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

2014

Embedded passive components for improved power plane decoupling

Maarten CauweJohan De BaetsArnaud GrivonJohannes StahrAlexandre Amedeo

Flexible and stretchable circuit technologies for space applications

Maarten CauweFrederick BossuytJohan De BaetsJan Vanfleteren

Flexible and stretchable electronics for wearable healthcare

Jeroen van den BrandMargreet de KokAshok SridharMaarten CauweRik VerplanckeFrederick BossuytJohan De BaetsJan Vanfleteren

Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications

Roel KustersAshok SridharMaarten CauweJeroen van den Brand

High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages

Swarnakamal PriyabadiniTom SterkenMaarten CauweLuc Van HoorebekeJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Material identification in electronics

Wesley van MeenselGeert WillemsMaarten Cauwe

Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

Daan van den EndeH van de WielRoel KustersAshok SridharJeroen SchramMaarten CauweJeroen van den Brand

A1 Journal Article in MICROELECTRONICS RELIABILITY

Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

Daan van den EndeRob HendriksRomain CauchoisRoel KustersMaarten CauweWilhelm GroenJeroen van den Brand

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY

Reduced 2nd level solder joint life time of low-CTE mold compound packages

Bart VandeveldeRiet LabieGeert WillemsLieven DegrendeleMaarten CauweJohan De Baets

Technology development for a flexible, low-cost backplane for lighting applications

Maarten CauweAshok SridharTom Sterken

Technology development for a flexible, low-cost backplane for lighting applications

Maarten CauweAshok SridharTom Sterken

2013

Active and passive component embedding into low-cost plastic substrates aimed at smart system applications

Maarten CauweBjorn VandecasteeleJohan De BaetsJeroen van den BrandRoel KustersAshok Sridhar

Design and Technology of Ultra Thin Chip Packages for High-Frequency Applications up to 60 GHz

Liang WangJan VanfleterenWalter De RaedtMaarten Cauwe

High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies

Daan van den EndeFrits VerhoevenPepijn van der EijndenRoel KustersAshok SridharMaarten CauweJeroen van den Brand

Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments

Maaike Op de BeeckAhmed JarbouiMaarten CauweHeidi DeclercqGriet UytterhoevenMaria CornelissenJan VanfleterenChris Van Hoof

Integration techniques and applications of thin chips on low cost foil substrates

Daan van den EndeAshok SridharRoel KustersJeroen van den BrandMaarten CauweBjorn Vandecasteele

Large area flexible lighting foils using distributed bare LED dies on polyester substrates

Daan van den EndeRoel KustersMaarten CauweA van der WaalJeroen van den Brand

A1 Journal Article in MICROELECTRONICS RELIABILITY

Parylene C for hermetic and flexible encapsulation of interconnects and electronic components

Ahmed JarbouiMaarten CauweFilip VermeirenRik VerplanckeHamadi KhemakhemJan VanfleterenMaaike Op de Beeck

Self-aligned flat ultra-thin chip package for flexible circuits

Liang WangMaarten CauweSteven BrebelsWalter De Raedt,Jan Vanfleteren

A1 Journal Article in CIRCUIT WORLD

2012

A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

Maarten CauweBjorn VandecasteeleJohan De BaetsJeroen van den BrandRoel KustersAshok Sridhar

Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments

Daan van den EndeRoel KustersMaarten CauweA van der WaalJeroen van den Brand

Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

Liang WangTom SterkenMaarten CauweDieter CuypersJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Novel interconnect methodologies for ultra-thin chips on foils

A SridharMaarten CauweH FledderusR KustersJ van den Brand

Novel methodology to integrate ultra-thin chips on flexible foils

Ashok SridharMaarten CauweRoel KustersHenri FledderusJeroen van den Brand

Towards reel-to-reel integration of ultra thin chips to polymer foils

Marcel TichemMaarten CauweZlatko HajdarevicEda KuranBenny NavehAshok SridharPhilipp Weissel

2011

Flipchip bonding of thin Si dies onto PET foils: possibilities and applications

Jeroen van den BrandRoel KustersMaarten CauweDaan van den EndeMuge Erinc

Frequency-dependent substrate characterization via an iterative pole search algorithm

Thomas DemeesterMaarten CauweDaniël De Zutter

A1 Journal Article in IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS

Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils

Maarten CauweBjorn VandecasteeleAn GielenJohan De BaetsJeroen van den BrandRoel Kusters

2010

High-frequency characterization of embedded components in printed circuit boards

Maarten CauweAndré Van Calster

Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components

Maarten CauweJohan De Baets

A1 Journal Article in IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

2008

Broadband material parameter characterization for practical high-speed interconnects on printed circuit board

Maarten CauweJohan De Baets

A1 Journal Article in IEEE TRANSACTIONS ON ADVANCED PACKAGING

Industrial and technical aspects of chip embedding technology

Andreas OstmannDionysios ManessisJohannes StahrMark BeesleyMaarten CauweJohan De Baets

2007

High-frequency modeling and measurements of tracks running on top of active components embedded in printed circuit boards

Maarten CauweJohan De Baets

2006

Embedding active components as a 3D packaging solution

Maarten CauweWim ChristiaensJan VanfleterenJohan De Baets

A2 Journal Article in Advancing Microelectronics

High-frequency characterization of embedded active components in printed circuit boards

Maarten CauweJohan De BaetsAndré Van Calster

2003

Laser ablation as an enabling technology for opto-boards.

Peter Van DaelePeter GeerinckGeert Van SteenbergeSteven Van PutMaarten Cauwe