Research Explorer

Your browser does not support JavaScript or JavaScript is not enabled. Without JavaScript some functions of this webapplication may be disabled or cause error messages. To enable JavaScript, please consult the manual of your browser or contact your system administrator.

Researcher

Jan Vanfleteren

360 Results

2023

A novel method for component positioning in thermoformed electronics

Behnam MadadniaFrederick BossuytJan Vanfleteren

Development of a microfluidic chip powered by EWOD for in vitro manipulation of bovine embryos

Adriana KarczAnn Van SoomKatrien SmitsSandra Van VlierbergheRik VerplanckeOsvaldo Américo Bogado PascottiniEtienne Van den AbbeelJan Vanfleteren

A1 Journal Article in BIOSENSORS-BASEL

Label-free electrochemical immunosensor for cervical cancer screening

Sallam Al-MadhagiPatricia KhashayarBo VerberckmoesEvelien PeetersElien De PaepeHeleen VermandereMieke AdriaensJan VanfleterenOlivier DegommeElizaveta Padalko

Measuring the Flex Life of Conductive Yarns in Narrow Fabric

Paula VeskeFrederick BossuytFilip ThielemansJan Vanfleteren

P16/KI67 LEVELS TO REVOLUTIONIZE CELLULAR DYSPLASIA DETECTION IN CERVICAL CANCER

Patricia KhashayarSallam Al-MadhagiBo VerberckmoesEvelien PeetersElien De PaepeHeleen VermandereMarleen PraetOlivier DegommeElizaveta PadalkoMieke Adriaens et al.

2022

A study on over-molded copper-based flexible electronic circuits

Mona BakrMartin HubmannFrederick BossuytJan Vanfleteren

A1 Journal Article in MICROMACHINES

Development of a stretchable circuit and its integration method on knit fabrics for lower back injury prevention

Paula VeskePieter BauwensFrederick BossuytTom SterkenJoke SchuermansJan Vanfleteren

A2 Journal Article in JOURNAL OF BIOMIMETICS BIOMATERIALS AND BIOMEDICAL ENGINEERING

Electrically-driven handling of gametes and embryos : taking a step towards the future of ARTs

Adriana KarczAnn Van SoomKatrien SmitsRik VerplanckeSandra Van VlierbergheJan Vanfleteren

A1 Journal Article in LAB ON A CHIP

Electronics integration into textiles : a study of technology, reliability, sustainability and applications

Paula VeskeJan VanfleterenFrederick Bossuyt

Innovative component positioning method for thermoformed electronics

Behnam MadadniaFrederick BossuytJan Vanfleteren

A1 Journal Article in FLEXIBLE AND PRINTED ELECTRONICS

Integration of electronics in plastics using injection molding processes

Mona BakrJan VanfleterenFrederick Bossuyt

Process optimization of injection overmolding structural electronics with regard to film distortion

Martin HubmannBehnam MadadniaJonas GrotenMartin PletzJan VanfleterenBarbara StadloberFrederick BossuytJatinder KaurThomas Lucyshyn

A1 Journal Article in POLYMERS

Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics

Behnam MadadniaFrederick BossuytJan Vanfleteren

A1 Journal Article in INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Testing for wearability and reliability of TPU lamination method in e-textiles

Paula VeskeFrederick BossuytJan Vanfleteren

A1 Journal Article in SENSORS

The integration of electronic circuits in plastics using injection technologies : a literature review

Mona BakrFrederick BossuytJan Vanfleteren

A1 Journal Article in FLEXIBLE AND PRINTED ELECTRONICS

Using non-stretchable structures for component positioning in thermoformed electronics

Behnam MadadniaFrederick BossuytJan Vanfleteren

A1 Journal Article in FLEXIBLE AND PRINTED ELECTRONICS

2021

Ex vivo generation and characterization of human hyaline and elastic cartilaginous microtissues for tissue engineering applications

David Sánchez-PorrasDaniel Durand-HerreraAna B. PaesJesús Chato-AstrainRik VerplanckeJan VanfleterenJosé Darío Sánchez-LópezÓscar Darío García-GarcíaFernando CamposVíctor Carriel

A1 Journal Article in BIOMEDICINES

Fully integrated flexible dielectric monitoring sensor system for real-time in situ prediction of the degree of cure and glass transition temperature of an epoxy resin

Yang YangBart PlovieGabriele ChiesuraThomas VervustLode DaelemansDiana-Elena MogosanuPieter WuytensKaren De ClerckJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT

In vivo blue light illumination for optogenetic inhibition : effect on local temperature and excitability of the rat hippocampus

Anirudh AcharyaBram VandekerckhoveLars Emil LarsenJean DelbekeWytse WadmanKristl VonckEvelien CaretteAlfred MeursJan VanfleterenPaul Boon et al.

A1 Journal Article in JOURNAL OF NEURAL ENGINEERING

Introduction of a high quality nanofilm of aluminum oxide enhances the performance of EWOD microfluidic platforms

Adriana KarczDavid SchaubroeckRik VerplanckeAnn Van SoomJan Vanfleteren

Over-molding of flexible polyimide-based electronic circuits

Mona BakrYibo SuAli RezaeiFrederick BossuytJan Vanfleteren

A1 Journal Article in FLEXIBLE AND PRINTED ELECTRONICS

Over-molding of two-dimensional curved shape using polyimide copper cladding foil

Mona BakrYibo SuAli RezaeiFrederick BossuytJan Vanfleteren

Reducing out-of-plane deformation of metal interconnects in structural electronics

Behnam MadadniaJan VanfleterenFrederick Bossuyt

Technological challenges in the development of optogenetic closed-loop therapy approaches in epilepsy and related network disorders of the brain

Bram VandekerckhoveJeroen MissinneKristl VonckPieter BauwensRik VerplanckePaul BoonRobrecht RaedtJan Vanfleteren

A1 Journal Article in MICROMACHINES

2020

Development and washing reliability testing of a stretchable circuit on knit fabric

Paula VeskePieter BauwensFrederick BossuytTom SterkenJan Vanfleteren

A1 Journal Article in APPLIED SCIENCES-BASEL

Flexible microsystems using over-molding technology

Mona BakrFrederick BossuytJan VanfleterenYibo Su

Long-term miniaturized flexible hermetic encapsulation for implantable medical devices using polymers and atomic layer deposited ceramics

Changzheng LiMaaike Op de BeeckJan Vanfleteren

Solar cells integration in over-molded printed electronics

Mona BakrPieter BauwensFrederick BossuytJan VanfleterenImen ChtiouiWim Christiaens

Vacuum lamination of a stretchable sensor system in polypropylene

Pieter BauwensFrederick BossuytJan Patrick DeckersJan Vanfleteren

2019

Design automation of meandered interconnects for stretchable circuits

Bart PlovieJan VanfleterenThomas VervustAndrés Felipe Vasquez QuinteroFrederick Bossuyt

A1 Journal Article in IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS

Effect of overmolding process on the integrity of electronic circuits

Mona BakrYibo SuFrederick BossuytJan Vanfleteren

Numerical simulation of a multi-inlet microfluidic device for biosensing purposes in osteoporosis management

Patricia KhashayarAmir OkhovatHossein AdibiJindrich WindelsGhassem AmoabedinyBagher LarijaniJan Vanfleteren

A2 Journal Article in JOURNAL OF DIABETES AND METABOLIC DISORDERS

Stretchable mould interconnect optimization : peeling automation and carrierless techniques

Bart PlovieYang YangSheila DunphyKristof DhaenensSteven Van PutFrederick BossuytJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Thermoplastic electronic circuits : design, technology and characterisation

Bart PlovieJan VanfleterenFrederick Bossuyt

2018

2.5/3D dynamically stretchable and permanently shaped electronic circuits

Imen ChtiouiFrederick BossuytJan VanfleterenMed Hedi Bedoui

A1 Journal Article in MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

3D multifunctional composites based on large-area stretchable circuit with thermoforming technology

Yang YangThomas VervustSheila DunphySteven Van PutBjorn VandecasteeleKristof DhaenensLieven DegrendeleLothar MaderLinde De VrieseTom Martens et al.

A1 Journal Article in ADVANCED ELECTRONIC MATERIALS

3D-printing technology as a means to create microfluidic channels mimicking the oviduct during in vitro culture of bovine embryos

Adriana KarczBabs Van de VoordeNathan CarpentierJasper Van HoorickKatrien SmitsRik VerplanckeJan VanfleterenAnn Van SoomSandra Van VlierbergheEtienne Van den Abbeel

Coupled half-mode cavity-backed slot antenna for IR-UWB in air-filled SIW technology

Quinten Van den BrandeSam LemeyJan VanfleterenHendrik Rogier

Design and Integration of Flexible Sensor Matrix for in Situ Monitoring of Polymer Composites

Yang YangGabriele ChiesuraBart PlovieThomas VervustGeert LuyckxJoris DegrieckTsuyoshi SekitaniJan Vanfleteren

A1 Journal Article in ACS SENSORS

From fibrils to toughness : multi-scale mechanics of fibrillating interfaces in stretchable electronics

Olaf van der SluisTijmen VermeijJan NeggersBart VossenMarc van MarisJan VanfleterenMarc GeersJohan Hoefnagels

A1 Journal Article in MATERIALS

Highly efficient impulse-radio ultra-wideband cavity-backed slot antenna in stacked air-filled substrate integrated waveguide technology

Quinten Van den BrandeSam LemeyJan VanfleterenHendrik Rogier

A1 Journal Article in IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION

Liquid crystal displays compatible with contact lenses for vision correction applications

Andrés Felipe Vasquez QuinteroPablo Pérez-MerinoRik VerplanckeJan VanfleterenHerbert De Smet

Microphysiological flux balance platform unravels the dynamics of drug induced steatosis

Avner EhrlichSabina Tsytkin-KirschenzweigKonstantinos IoannidisMuneef AyyashAnne RiuReine NoteGladys OuedraogoJan VanfleterenMerav CohenYaakov Nahmias

A1 Journal Article in LAB ON A CHIP

Mimicking the in vivo environment of the oviduct in microfluidic channels for the in vitro culture of mammalian embryos using hydrogels and 3D printing technology

Adriana KarczBabs Van de VoordeNathan CarpentierKatrien SmitsJasper Van HoorickRik VerplanckeAnn Van SoomEtienne Van den AbbeelJan VanfleterenSandra Van Vlierberghe

Multifunctional and miniaturized flexible sensor patch : design and application for in situ monitoring of epoxy polymerization

Yang YangKe XuThomas VervustJan Vanfleteren

A1 Journal Article in SENSORS AND ACTUATORS B-CHEMICAL

PoCOsteo : PoC in-office device for identifying individuals at high risk of osteoporosis and osteoporotic fracture

Patricia KhashayarFrederik LeysPaula Dias Lopes CamposA OstovarG ScholsR GranseeD LattaP BiggsIJ RileyCK O'Sullivan et al.

Simple method of creating microfluidic structures using 3D printing

Adriana KarczAnn Van SoomJan Vanfleteren

Stretchability : the metric for stretchable electrical interconnects

Bart PlovieFrederick BossuytJan Vanfleteren

A1 Journal Article in MICROMACHINES

2017

A highly sensitive electrochemical biosensor based on AuNP-modified gold electrodes for selective determination of serum levels of crosslaps

Patricia KhashayarGhassem AmoabedinyBagher LarijaniMorteza HosseiniRik VerplanckeMichel De KeersmaeckerMieke AdriaensStefan GoemaereTOM FIERSJan Vanfleteren

A1 Journal Article in 3 BIOTECH

A multiplexed microfluidic platform for bone marker measurement : a proof-of-concept

Patricia KhashayarGhassem AmoabedinyBagher LarijaniMorteza HosseiniRik VerplanckeDavid SchaubroeckSteven Van PutFarideh RaziMichel De KeersmaeckerMieke Adriaens et al.

A1 Journal Article in MICROMACHINES

An electrochemical biosensor based on AuNP-modified gold electrodes for selective determination of serum levels of osteocalcin

Patricia KhashayarGhassem AmoabedinyMorteza HosseiniRik VerplanckeFarideh RaziJan VanfleterenBagher Larijani

A1 Journal Article in IEEE SENSORS JOURNAL

Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers

Bart PlovieYang YangJoren GuillaumeSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleThomas VervustFrederick BossuytJan Vanfleteren

A1 Journal Article in ADVANCED ENGINEERING MATERIALS

Autonomous wearable RFID-based sensing platform for the Internet-of-Things

Sam LemeySam AgneessensPatrick Van TorreKristof BaesHendrik RogierJan Vanfleteren

Fabrication and verification of conjugated AuNP-antibody nanoprobe for sensitivity improvement in electrochemical biosensors

Patricia KhashayarGhassem AmoabedinyBagher LarijaniMorteza HosseiniJan Vanfleteren

A1 Journal Article in SCIENTIFIC REPORTS

Fabrication of fixed-shape soft smart objects by thermoplastic forming of flat stretchable circuits

Andrés Felipe Vasquez QuinteroJan VanfleterenFrederick BossuytBart PlovieRik VerplanckeHerbert De Smet

Flex PCB based technology for randomly shaped circuits

Jan VanfleterenFrederick BossuytBart Plovie

Flexible and stretchable electronic sensor systems for composites production process monitoring

Yang YangJan VanfleterenThomas Vervust

In-office proteomic platform for bone marker measurement

Patricia KhashayarG. AmoabedinyJan VanfleterenB. Larijani

Key generation based on fast reciprocal channel estimation for body-worn sensor nodes

Patrick Van TorreQuinten Van den BrandeJo VerhaevertJan VanfleterenHendrik Rogier

Modular transmitter and receiver for space-time coding

Quinten Van den BrandePatrick Van TorreJo VerhaevertJan VanfleterenHendrik Rogier

One-Time Deformable Thermoplastic Devices Based on Flexible Circuit Board Technology

Bart PlovieMaarten CauweFrederick BossuytJan Vanfleteren

Rapid prototyping of microfluidic chips using laser-cut double-sided tape for electrochemical biosensors

Patricia KhashayarGhassem AmoabedinyBagher LarijnaiMorteza HosseiniSteven Van PutRik VerplanckeJan Vanfleteren

A1 Journal Article in JOURNAL OF THE BRAZILIAN SOCIETY OF MECHANICAL SCIENCES AND ENGINEERING

Stretchable electronic platform for soft and smart contact lens applications

Andrés Felipe Vasquez QuinteroRik VerplanckeHerbert De SmetJan Vanfleteren

A1 Journal Article in ADVANCED MATERIALS TECHNOLOGIES

Stretchable platform enabled with wireless power for smart contact lenses

Andrés Felipe Vasquez QuinteroRik VerplanckeHerbert De SmetJan Vanfleteren

Thermoplastically Shaped Wearable Medical Devices

Bart PlovieSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleFrederick BossuytJan Vanfleteren

2016

Arbitrarily shaped rigid and smart objects using stretchable interconnections

Imen ChtiouiFrederick BossuytMargreet de KokJan VanfleterenMohamed Hedi Bedoui

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Biodegradable fluidic microsystems for cell cultures and tissue engineering

Diana-Elena MogosanuJan VanfleterenPeter Dubruel

Bone biosensors: knowing the present and predicting the future

Patricia KhashayarGhassem AmoabedinyBagher LarijaniJan Vanfleteren

A1 Journal Article in JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Characterization of gold nanoparticle layer deposited on gold electrode by various techniques for improved sensing abilities

Patricia KhashayarGhassem AmoabedinyBagher LarijaniMorteza HosseiniRik VerplanckeDavid SchaubroeckMichel De KeersmaeckerMieke AdriaensJan Vanfleteren

A2 Journal Article in BIOINTERFACE RESEARCH IN APPLIED CHEMISTRY

Design and fabrication of a flexible dielectric sensor system for in situ and real-time production monitoring of glass fibre reinforced composites

Yang YangGabriele ChiesuraThomas VervustFrederick BossuytGeert LuyckxJoris DegrieckJan Vanfleteren

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

Design and fabrication of a shielded interdigital sensor for noninvasive in situ real-time production monitoring of polymers

Yang YangGabriele ChiesuraThomas VervustJoris DegrieckJan Vanfleteren

A1 Journal Article in JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS

Design and modelling of thermoformed displays for smart contact lenses

Andrés Felipe Vasquez QuinteroRik VerplanckeJan VanfleterenHerbert De Smet

Design, technology and evaluation of a microfluidic chip for point-of-care diagnosis of bone turnover biomarkers

Patricia KhashayarJan VanfleterenGhasem AmoabedinyBagher LarijaniRik Verplancke

Fabrication of 3-dimensional biodegradable microfluidic environments for tissue engineering applications

Diana-Elena MogosanuRik VerplanckePeter DubruelJan Vanfleteren

A1 Journal Article in MATERIALS & DESIGN

Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light

Yang YangSu DingTeppei ArakiJinting JiuTohru SugaharaJun WangJan VanfleterenTsuyoshi SekitaniKatsuaki Suganuma

A1 Journal Article in NANO RESEARCH

Low-profile antenna systems for the Next-Generation Internet of Things applications

Sam LemeyHendrik RogierJan Vanfleteren

Non-destructive evaluation of an infusion process using capacitive sensing technique

Yang YangThomas VervustFrederick BossuytJan VanfleterenGabriele ChiesuraGeert LuyckxJoris DegrieckMarkus Kaufmann

One-time deformable thermoplastic devices based on flexible circuit board technology

Bart PlovieYang YangJoren GuillaumeSheila DunphyKristof DhaenensSteven Van PutThomas VervustFrederick BossuytJan Vanfleteren

Poly(polyol sebacate) elastomers as coatings for metallic coronary stents

Lucila NavarroDiana-Elena MogosanuThijs de JongAstrid D BakkerDavid SchaubroeckJulio LunaIgnacio RintoulJan VanfleterenPeter Dubruel

A1 Journal Article in MACROMOLECULAR BIOSCIENCE

RTM production monitoring of the A380 hinge arm droop nose mechanism: a multi-sensor approach

Gabriele ChiesuraAlfredo LambertiYang YangGeert LuyckxWim Van PaepegemSteve VanlanduitJan VanfleterenJoris Degrieck

A1 Journal Article in SENSORS

Real-time monitoring of metabolic function in liver-on-chip microdevices tracks the dynamics of mitochondrial dysfunction

D BavliS PrillE EzraG LevyM CohenM VinkenJan VanfleterenM JaegerY Nahmias

A1 Journal Article in PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

Smart contact lens platform with a deformed active artificial iris

Andrés Felipe Vasquez QuinteroSimon DelcourRik VerplanckeHerbert De SmetJan Vanfleteren

Stretchable electronic platform for soft and smart contact lens applications

Andrés Felipe Vasquez QuinteroRik VerplanckeJelle De SmetHerbert De SmetJan Vanfleteren

Stretchable passive matrix LED display with thin-film based interconnects

Rik VerplanckeMaarten CauweSteven Van PutEdsger SmitsRoel KustersGert Van HeckJeroen Van den BrandMitsuhiro MurataHideki OhmaeYoshihiro Tomita et al.

Threefold rotationally symmetric SIW antenna array for ultra-short-range MIMO communication

Sam LemeyThijs CastelPatrick Van TorreThomas VervustJan VanfleterenPiet DemeesterDries Vande GinsteHendrik Rogier

A1 Journal Article in IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION

Wearable flexible lightweight modular RFID tag with integrated energy harvester

Sam LemeySam AgneessensPatrick Van TorreK BaesJan VanfleterenHendrik Rogier

A1 Journal Article in IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

2015

2.5D smart objects using thermoplastic stretchable interconnects

Bart PlovieSheila DunphyKristof DhaenensSteven Van PutBjorn VandecasteeleFrederick BossuytJan Vanfleteren

Applying QMSIW technique in textile for compact wearable design and high body-antenna isolation

Sam AgneessensSam LemeyHendrik RogierThomas VervustJan Vanfleteren

Bone biosensors : knowing the present and predicting the future

Patricia KhashayarGhassem H. A. AmoabedinyBagher L. LarijaniJan Vanfleteren

Cure degree monitoring of an infusion proces by deformable electronic circuit with integrated capacitive sensors

Yang YangGabriele ChiesuraThomas VervustFrederick BossuytGeert LuyckxMarkus KaufmannJoris DegrieckJan Vanfleteren

Deformable microsystem for in situ cure degree monitoring of GFRP(Glass Fibre Reinforced Plastic)

Yang YangGabriele ChiesuraThomas VervustFrederick BossuytGeert LuyckxMarkus KaufmannJoris DegrieckJan Vanfleteren

Flexible and stretchable electronics for wearable health devices

Jeroen van den BrandMargreet de KokMark KoetseMaarten CauweRik VerplanckeFrederick BossuytMichal JablonskiJan Vanfleteren

A1 Journal Article in SOLID-STATE ELECTRONICS

Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections

Jan VanfleterenBart PlovieYang YangJelle De SmetRik VerplanckeFrederick BossuytHerbert De Smet

Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability

Michal JablonskiJan VanfleterenThomas VervustFrederick BossuytRiccardo LucchiniPasquale VenaHans De VriesMario Gonzalez

A1 Journal Article in MICROELECTRONICS RELIABILITY

Integration of membranes in 3-D biodegradable and biocompatible microfluidic bioreactors

Diana-Elena MogosanuRik VerplanckeJan VanfleterenLucila NavarroPeter Dubruel

Novel bio-elastomers as coating materials for metallic coronary stents

Lucila NavarroDiana-Elena MogosanuDavid SchaubroeckJan VanfleterenPeter Dubruel

Stretchable 45 x 80 RGB LED display using meander wiring technology

Hideki OhmaeYoshihiro TomitaMitsuhiro KasaharaJeroen SchramEdsger SmitsJeroen Van den BrandFrederick BossuytJan VanfleterenJohan De Baets

Surface modification of an epoxy resin with polyamines and polydopamine: adhesion towards electroless deposited copper

David SchaubroeckLothar MaderPeter DubruelJan Vanfleteren

A1 Journal Article in APPLIED SURFACE SCIENCE

Surface modifications of epoxy resins to improve the adhesion towards electroless deposited copper

David SchaubroeckJan VanfleterenPeter Dubruel

2014

Active textile antennas in professional garments for sensing, localisation and communication

Arnaut DierckSam AgneessensFrederick DeclercqBart SpinnewynGert-Jan StockmanPatrick Van TorreLuigi VallozziDries Vande GinsteThomas VervustJan Vanfleteren et al.

A1 Journal Article in INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES

Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers

Jan VanfleterenImen ChtiouiBart PlovieYang YangFrederick BossuytThomas VervustSheila DunphyBjorn Vandecasteele

Conformable light emitting modules

Michal JablonskiJan VanfleterenFrederick Bossuyt

Conformable, low level light therapy platform

Michal JablonskiFrederick BossuytJan VanfleterenThomas VervustHerbert De Smet

Development of a dielectric sensor system for the on-line cure monitoring of composites

Yang YangGabriele ChiesuraGeert LuyckxThomas VervustFrederick Bossuytmarkus kaufmannJoris DegrieckJan Vanfleteren

Fabrication and functionalization of PCB gold electrodes suitable for DNA-based electrochemical sensing

Pietro SalvoOYF HenryKristof DhaenensJLA SanchezAn GielenBW SolnestamJ LundebergCK O'SullivanJan Vanfleteren

A1 Journal Article in BIO-MEDICAL MATERIALS AND ENGINEERING

Flexible and stretchable circuit technologies for space applications

Maarten CauweFrederick BossuytJohan De BaetsJan Vanfleteren

Flexible and stretchable electronics for wearable healthcare

Jeroen van den BrandMargreet de KokAshok SridharMaarten CauweRik VerplanckeFrederick BossuytJohan De BaetsJan Vanfleteren

High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages

Swarnakamal PriyabadiniTom SterkenMaarten CauweLuc Van HoorebekeJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

In situ on-line cure monitoring of composites by embedded interdigital sensor

Yang YangGabriele ChiesuraGeert LuyckxThomas VervustFrederick Bossuytmarkus kaufmannJan VanfleterenJoris Degrieck

Mechanical analysis of encapsulated metal interconnects under transversal load

Bjorn Van KeymeulenMario GonzalezFrederick BossuytJohan De BaetsJan Vanfleteren

Stretchable optical waveguides

Jeroen MissinneSandeep KalathimekkadBram Van HoeErwin BosmanJan VanfleterenGeert Van Steenberge

A1 Journal Article in OPTICS EXPRESS

Surface characterization and stability of an epoxy resin surface modified with polyamines grafted on polydopamine

David SchaubroeckYannick VercammenLuc Van VaeckEls VanderleydenPeter DubruelJan Vanfleteren

A1 Journal Article in APPLIED SURFACE SCIENCE

Surface modification of an epoxy resin with polyamines and polydopamine: the effect on the initial electroless copper deposition

David SchaubroeckLothar MaderNathalie De GeyterRino MorentPeter DubruelJan Vanfleteren

A1 Journal Article in APPLIED SURFACE SCIENCE

Towards an implantable bioreactor: synthesis and surface modification strategy for a soft tissue engineered elastomer

Diana-Elena MogosanuJan VanfleterenPeter Dubruel

2013

3D stacking of ultrathin chip packages: an innovative packaging and interconnection technology

Swarnakamal PriyabadiniTom SterkenLuc Van HoorebekeJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

3D-stacking of ultra-thin chips and chip packages

Swarnakamal PriyabadiniJan VanfleterenTom Sterken

A wireless sensor network protocol for an inertial motion tracking system

Benoît HuygheJan DoutreloigneJan Vanfleteren

A1 Journal Article in WIRELESS PERSONAL COMMUNICATIONS

Adhesion test for UTCP structure in humid environment

Kati KokkoTom SterkenFilip VermeirenJan Vanfleteren

Conformable, light emitting devices

Michal JablonskiFrederick BossuytJan VanfleterenKunigunde ` CherenackAhmed SalemRicardo Ureta Hortiguela

Design and Technology of Ultra Thin Chip Packages for High-Frequency Applications up to 60 GHz

Liang WangJan VanfleterenWalter De RaedtMaarten Cauwe

Development of a stretchable platform for the fabrication of biocompatible microsystems

Amir JahanshahiJan Vanfleteren

Draagbare elektronica met ultradunne chips en elastische circuits

Jan Vanfleteren

Flexible and stretchable electronics

Jan Vanfleteren

Generic technology platform for the integration of microelectronics and microfluidics on stretchable substrates

Rik VerplanckeJan VanfleterenDieter Cuypers

Highly flexible, low loss feed structure for active wearable aperture coupled antennas with radically trimmed substrate

Arnaut DierckFrederick DeclercqHendrik RogierThomas VervustJan Vanfleteren

Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments

Maaike Op de BeeckAhmed JarbouiMaarten CauweHeidi DeclercqGriet UytterhoevenMaria CornelissenJan VanfleterenChris Van Hoof

One-time deformable electronics

Imen ChtiouiSheila DunphyKristof DhaenensMaaike Op de BeeckMohamed Hedi BedouiJan VanfleterenFrederick Bossuyt

PCB technology based stretchable circuits

Jan VanfleterenMario GonzalezFrederick BossuytThomas VervustIngrid De WolfMichal Jablonski

PDMS selective bonding for the fabrication of biocompatible all polymer NC microvalves

Amir JahanshahiPietro SalvoJan Vanfleteren

A1 Journal Article in JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Parylene C for hermetic and flexible encapsulation of interconnects and electronic components

Ahmed JarbouiMaarten CauweFilip VermeirenRik VerplanckeHamadi KhemakhemJan VanfleterenMaaike Op de Beeck

Photo-definable polyimide-based flat UTCP technology for 3D-stacking application

Swarnakamal PriyabadiniTom SterkenMaaike Op de BeeckJan Vanfleteren

Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor

Michal JablonskiFrederick BossuytJan VanfleterenThomas VervustHans de Vries

A1 Journal Article in MICROELECTRONICS RELIABILITY

Self sensing composites: an added value for the complete life cycle of composite structures

Geert LuyckxGabriele ChiesuraYang YangEli VoetJan VanfleterenJoris Degrieck

Self-aligned flat ultra-thin chip package for flexible circuits

Liang WangMaarten CauweSteven BrebelsWalter De Raedt,Jan Vanfleteren

A1 Journal Article in CIRCUIT WORLD

Stretchable circuits with horseshoe shaped conductors: embedded in elastic polymers

Amir JahanshahiMario GonzalezJeroen van den BrandFrederick BossuytThomas VervustRik VerplanckeJan Vanfleteren

A1 Journal Article in JAPANESE JOURNAL OF APPLIED PHYSICS

Stretchable electronics technology for large area applications: fabrication and mechanical characterization

Frederick BossuytThomas VervustJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Synthesis and surface modification strategies for a soft tissue engineered material

Diana-Elena MogosanuJan VanfleterenPeter Dubruel

Textile antenna systems for positioning and off-body communication

Hendrik RogierSam AgneessensFrederick DeclercqArnaut DierckWout JosephMarc MoeneclaeyLuigi VallozziPatrick Van TorreJan Vanfleteren

Thin-film based stretchable electronics technologies

Rik VerplanckeAmir JahanshahiTom SterkenDieter CuypersJan Vanfleteren

Ultra-thin chip package (UTCP) and elastic circuit technologies for compact or conformable sensor and electronics assemblies

Jan Vanfleteren

2012

A 3D printed dry electrode for ECG/EEG recording

Pietro SalvoRobrecht RaedtEvelien CarretteDavid SchaubroeckJan VanfleterenLudwig Cardon

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

Adhesive bonding by SU-8 transfer for assembling microfluidic devices

Pietro SalvoRik VerplanckeFrederick BossuytDaniel LattaBjorn VandecasteeleChengxun LiuJan Vanfleteren

A1 Journal Article in MICROFLUIDICS AND NANOFLUIDICS

An approach to produce a stack of photo definable polyimide based flat UTCPs

Swarnakamal PriyabadiniTom SterkenLiang WangKristof DhaenensBjorn VandecasteeleSteven Van PutAndreas Erik PetersenJan Vanfleteren

Biocompatible packaging solutions for implantable electronic systems for medical applications

Maaike Op de BeeckJohn O'CallaghanKaren QianKarl MalachowskiJan VanfleterenChris Van Hoof

Embedding thinned chips in flexible PCBs

Tom SterkenFilip VermeirenPiers TremlettWim ChristiaensJan Vanfleteren

Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

Liang WangTom SterkenMaarten CauweDieter CuypersJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Fabrication of a biocompatible flexible electroosmosis micropump

Amir JahanshahiFabrice AxisaJan Vanfleteren

A1 Journal Article in MICROFLUIDICS AND NANOFLUIDICS

Feasibility study and performance analysis of a gyroless orientation tracker

Benoît HuyghePietro SalvoJan DoutreloigneJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT

Fluorescence-based optochemical sensor on flexible foils

Sandeep KalathimekkadJeroen MissinneJuan Diego Arias EspinozaBram Van HoeErwin BosmanEdsger SmitsRajesh MandamparambilGeert Van SteenbergeJan Vanfleteren

Foil-based optical technology platform for optochemical sensors

Sandeep KalathimekkadJeroen MissinneJuan Diego Arias EspinozaBram Van HoeErwin BosmanEdsger SmitsRajesh MandamparambilGeert Van SteenbergeJan Vanfleteren

High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Tom SterkenMaaike Op de BeeckFilip VermeirenTom TorfsLiang WangSwarnakamal PriyabadiniKristof DhaenensDieter CuypersJan Vanfleteren

Influence of barrier absorption properties on laser patterning thin organic films

Sanjeev NaithaniRajesh MandamparambilFerdie van AsscheDavid SchaubroeckHenri FleddreusAn PrenenGeert Van SteenbergeJan Vanfleteren

Integration of stretchable and washable electronic modules for smart textile applications

Thomas VervustGuy BuyleFrederick BossuytJan Vanfleteren

A1 Journal Article in JOURNAL OF THE TEXTILE INSTITUTE

Plastic electronics based conformable electronic circuits

Frederick BossuytSheila DunphyJan VanfleterenJohan De BaetsKP MorilloJ Van den Brand

Printed circuit board technology inspired stretchable circuits

Jan VanfleterenMario GonzalezFrederick BossuytYung-Yu HsuThomas VervustIngrid De WolfMichal Jablonski

A1 Journal Article in MRS BULLETIN

Reliable stretchable gold interconnects in biocompatible elastomers

Amir JahanshahiPietro SalvoJan Vanfleteren

A1 Journal Article in JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS

SCB and SMI: two stretchable circuit technologies, based on standard printed circuit board processes

Jan VanfleterenThomas LoeherMario GonzalezFrederick BossuytThomas VervustIngrid De WolfMichal Jablonski

A1 Journal Article in CIRCUIT WORLD

Short, stretchable molded interconnect reliability under 10% cyclic elongation

Michal JablonskiJan VanfleterenThomas VervustFrederick Bossuyt

Solution-processed and low-temperature metal oxide n-channel thin-film transistors and low-voltage complementary circuitry on large-area flexible polyimide foil

Maarten RockeléDuy-Vu PhamJürgen SteigerSilviu BotnarasDennis WeberJan VanfleterenTom SterkenDieter CuypersSoeren SteudelKris Myny et al.

A1 Journal Article in JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY

Stretchable and washable electronics for embedding in textiles

Thomas VervustJan Vanfleteren

Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers

Amir JahanshahiPietro SalvoJan Vanfleteren

Synchronizing music and movement with BeatLED: an interactive musical social game

Tom De NiesThomas VervustMichiel DemeyMarc LemanJan VanfleterenRik Van de Walle

A1 Journal Article in JOURNAL OF NEW MUSIC RESEARCH

Thin-film stretchable electronics technology based on meandering interconnections: fabrication and mechanical performance

Rik VerplanckeFrederick BossuytDieter CuypersJan Vanfleteren

A1 Journal Article in JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Thinned dies in a stretchable package

Rik VerplanckeTom SterkenDieter CuypersJan Vanfleteren

Two axis optoelectronic tactile shear stress sensor

Jeroen MissinneErwin BosmanBram Van HoeRik VerplanckeGeert Van SteenbergeSandeep KalathimekkadPeter Van DaeleJan Vanfleteren

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

Ultra thin optical tactile shear sensor

Jeroen MissinneErwin BosmanBram Van HoeRik VerplanckeGeert Van SteenbergeSandeep KalathimekkadPeter Van DaeleJan Vanfleteren

2011

3D-stacking of UTCPs as a module miniaturization technology

Swarnakamal PriyabadiniAn GielenKristof DhaenensWim ChristiaensSteven Van PutGerhard KunkelAnders Erik PetersenJan Vanfleteren

A Reliable and comfortable package for wearable medical devices

Tom SterkenJan VanfleterenFrederick BossuytSteven BrebelsWim ChristiaensThomas VervustMichal JablonskiSheila DunphyFilip VermeirenYung-yu Hsu et al.

Analysis of failure mechanisms of machine embroidered electrical contacts and solutions for improved reliability

Torsten LinzJan Vanfleteren

Design and implementation of a mobile sensor system for human posture tracking

Benoît HuygheJan DoutreloigneJan Vanfleteren

Design and implementation of flexible and stretchable systems

Mario GonzalezBart VandeveldeWim ChristiaensYung-Yu HsuFrançois IkerFrederick BossuytJan VanfleterenOlaf van der SluisPHM Timmermans

A1 Journal Article in MICROELECTRONICS RELIABILITY

Design of an implantable slot dipole conformal flexible antenna for biomedical applications

Maria Lucia ScarpelloDivya KurupHendrik RogierDries Vande GinsteFabrice AxisaJan VanfleterenWout JosephLuc MartensGünter Vermeeren

A1 Journal Article in IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION

Developing an advanced module for back-contact solar cells

Jonathan GovaertsJ RobbeleinM GonzalezI GordonK BaertI De WolfFrederick BossuytSteven Van PutJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Development of conformable optical and optoelectronic based tactile sensors

Jeroen MissinneJan VanfleterenGeert Van Steenberge

Fabrication of an implantable stretchable electro-osmosis pump

Amir JahanshahiFabrice AxisaJan Vanfleteren

Flexible shear sensor based on embedded optoelectronic components

Jeroen MissinneErwin BosmanBram Van HoeGeert Van SteenbergeSandeep KalathimekkadPeter Van DaeleJan Vanfleteren

A1 Journal Article in IEEE PHOTONICS TECHNOLOGY LETTERS

In-body path loss models for implants in heterogeneous human tissues using implantable slot dipole conformal flexible antennas

Divya KurupMaria Lucia ScarpelloGünter VermeerenWout JosephKristof DhaenensFabrice AxisaLuc MartensDries Vande GinsteHendrik RogierJan Vanfleteren

A1 Journal Article in EURASIP JOURNAL ON WIRELESS COMMUNICATIONS AND NETWORKING

Low-temperature and low-voltage, solution-processed metal oxide n-TFTs and flexible circuitry on large-area polyimide foil

Maarten RockeléDuy-Vu PhamJürgen SteigerSilviu BotnarasDennis WeberJan VanfleterenTom SterkenDieter CuypersSoeren SteudelKris Myny et al.

Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization

Yung-Yu HsuMario GonzalezFrederick BossuytJan VanfleterenIngrid De Wolf

A1 Journal Article in IEEE TRANSACTIONS ON ELECTRON DEVICES

Shape-memory anchoring system for bladder sensors

Iaci M PereiraFabrice AxisaRodrigo L OréficeJan VanfleterenHercules P Neves

A1 Journal Article in JOURNAL OF BIOMEDICAL MATERIALS RESEARCH PART B-APPLIED BIOMATERIALS

System-in-foil technology

Andreas DietzelJeroen van den BrandJan VanfleterenWim ChristiaensErwin BosmanJohan De Baets

Bookchapter in Ultra-thin chip technology and applications

The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

Yung Yu HsuMario GonzalezFrederick BossuytFabrice AxisaJan VanfleterenIngrid De Wolf

A1 Journal Article in THIN SOLID FILMS

Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system

Tom SterkenJan VanfleterenTom TorfsMaaike Op de BeeckFrederick BossuytChris Van Hoof

beatLED: the social gaming partyshirt

Tom De NiesThomas VervustMichiel DemeyRik Van de WalleJan VanfleterenMarc Leman

2010

3-D simulation of compound thin-film transistors

André Van CalsterJan Vanfleteren

A1 Journal Article in JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY

Design and analysis of a novel fine pitch and highly stretchable interconnect

Yung Yu HsuMario GonzalezFrederick BossuytFabrice AxisaJan VanfleterenBart VandeveldeIngrid De Wolf

A1 Journal Article in MICROELECTRONICS INTERNATIONAL

Development of a thin-film stretchable electrical interconnection technology for biocompatible applications

Rik VerplanckeTom SterkenFabrice AxisaJan Vanfleteren

Embedded flexible optical shear sensor

Jeroen MissinneErwin BosmanBram Van HoeGeert Van SteenbergePeter Van DaeleJan Vanfleteren

Embedded high resolution sensor based on optical feedback in a Vertical Cavity Surface Emitting Laser

Bram Van HoeDeben LamonErwin BosmanGeert Van SteenbergeJeroen MissinnePauwel GoethalsPanajotov KrassimirDominiek ReynaertsJan VanfleterenPeter Van Daele

Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Jonathan GovaertsErwin BosmanWim ChristiaensJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON ADVANCED PACKAGING

Flexible monolithic active pixel sensors embedded in ultra thin polymer film

W DulinskiJ BaudotN Chon-SenM DeveauxM GoffeK MinoglouP De MoorC MntzTom SterkenJ Stroth et al.

From single conductive layer to double conductive layer stretchable electronics

Frederick BossuytThomas VervustFabrice AxisaJan Vanfleteren

High density optical pressure sensor foil based on arrays of crossing flexible waveguides

Jeroen MissinneGeert Van SteenbergeBram Van HoeErwin BosmanChristof DebaesJürgen Van ErpsChunxiao YanEleonora FerrarisPeter Van DaeleJan Vanfleteren et al.

Highly reliable flexible active optical links

Erwin BosmanGeert Van SteenbergeBram Van HoeJeroen MissinneJan VanfleterenPeter Van Daele

A1 Journal Article in IEEE PHOTONICS TECHNOLOGY LETTERS

Lifetime of stretchable meander-shaped copper conductors in PDMS subjected to cyclic elongation

Tom SterkenFrederick BossuytRik VerplanckeThomas VervustFabrice AxisaJan Vanfleteren

Module miniaturization by ultra thin package stacking

Thomas LoeherDavid SchuetzeWim ChristiaensKristof DhaenensSwarnakamal PriyabadiniAndreas OstmannJan Vanfleteren

Performance of a new type of module based on back-contact solar cells

Jonathan GovaertsJo RobbeleinChun GongBartek J PawlakMario GonzalezIngrid De WolfFrederick BossuytSteven Van PutIvan GordonKris Baert et al.

Reliability assessment of stretchable interconnects

Yung Yu HsuB DimcicMario GonzalezFrederick BossuytJan VanfleterenIngrid De Wolf

Stretchable and washable electronics for embedding in textiles

Thomas VervustFrederick BossuytFabrice AxisaJan Vanfleteren

The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit

Yung Yu HsuMario GonzalezFrederick BossuytFabrice AxisaJan VanfleterenIngrid De Wolf

A1 Journal Article in JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Thermo-mechanical analysis of flexible and stretchable systems

Mario GonzalezBart VandeveldeWim ChristiaensYung Yu HsuFrancois IkerFrederick BossuytJan VanfleterenOlaf Van der SluisPieter Timmermans

Thin-film interconnection technology for use in a stretchable cell culture platform

Rik VerplanckeFrederick BossuytTom SterkenJan Vanfleteren

UTCP: a novel polyimide-based ultra-thin chip packaging technology

Wim ChristiaensErwin BosmanJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

2009

3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems

Wim ChristiaensTom TorfsWim HuwelChris Van HoofJan Vanfleteren

3D Integration of ultra-thin functional devices inside standard multilayer flex laminates

Wim ChristiaensTom TorfsWim HuwelChris Van HoofJan Vanfleteren

3D Orientation tracking based on unscented Kalman filtering of accelerometer and magnetometer data

Benoît HuygheJan DoutreloigneJan Vanfleteren

A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substrate

Frederick BossuytThomas VervustFabrice AxisaJan Vanfleteren

An array waveguide sensor for artificial optical skins

Jeroen MissinneGeert Van SteenbergeBram Van HoeKristof Van CoillieTim Van GijseghemPeter DubruelJan VanfleterenPeter Van Daele

Design and fabrication of a low cost implantable bladder pressure monitor

Fabrice AxisaP JourandEvi LippensMonika Rymarczyk-MachalN De SmetEtienne SchachtJan VanfleterenR PuersMaria Cornelissen

Design and implementation of advanced systems in a flexible-stretchable technology for biomedical applications

R CartaP JourandB HermansJ ThonéDominique BrosteauxThomas VervustFrederick BossuytFabrice AxisaJan VanfleterenR Puers

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

Design and performance of metal conductors for stretchable electronic circuits

Mario GonzalezFabrice AxisaFrederick BossuytYung Yu HsuBart VandeveldeJan Vanfleteren

A1 Journal Article in CIRCUIT WORLD

Design of flexible, low-power and wireless sensor nodes for human posture tracking aiding epileptic seizure detection

Benoît HuygheJan VanfleterenJan Doutreloigne

Embedded chips redefine miniaturization

Els PartonWim ChristiaensJan Vanfleteren

A2 Journal Article in PRINTED CIRCUIT DESIGN & FAB

Fabrication processes for embedding thin chips in flat flexible substrates

Jonathan GovaertsWim ChristiaensErwin BosmanJan Vanfleteren

A1 Journal Article in IEEE TRANSACTIONS ON ADVANCED PACKAGING

Flexible wireless biopotential system with embedded ultra-thin chip

Tom TorfsWim ChristiaensJan VanfleterenWim HuwelWim PerduRF YaziciogluSteven BrebelsChris Van Hoof

Fully embedded optical and electrical interconnections in flexible foils

Erwin BosmanGeert Van SteenbergePeter GeerinckJan VanfleterenPeter Van Daele

Improved passive-matrix multiplexability with a modular display and UTCP technology

Pieter BauwensAnn MontéWim ChristiaensJan DoutreloigneJan Vanfleteren

A1 Journal Article in DISPLAYS

In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect

Yung-Yu HsuMario GonzalezFrederick BossuytFabrice AxisaJan VanfleterenIngrid De Wolf

A1 Journal Article in JOURNAL OF MATERIALS RESEARCH

In vitro cytotoxicity testing and the application of elastic interconnection technology for short-term implantable electronics

Dominique BrosteauxEvi LippensMaria CornelissenEtienne SchachtRiccardo CartaPhilippe JourandRobert PuersFabrice AxisaThomas VervustFrederick Bossuyt et al.

Nieuwe benadering voor druksensoren: flexibele artificiële optische huid

Bram Van HoeK. Van CoillieGeert Van SteenbergeJan VanfleterenPeter Van Daele

Remote atmospheric pressure DC glow discharge treatment for adhesion improvement of PDMS

Nathalie De GeyterRino MorentTinneke JacobsFabrice AxisaLéon GengembreChristophe LeysJan VanfleterenEdmond Payen

A1 Journal Article in PLASMA PROCESSES AND POLYMERS

Stretchable Electrical Interconnections: A Promising Technology for Use in Stretchable Microelectrode Arrays

Rik VerplanckeJan Vanfleteren

Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection

Jonathan GovaertsWim ChristiaensJan Vanfleteren

2008

Active optical links embedded in flexible substrates

Erwin BosmanGeert Van SteenbergeWim ChristiaensNina HendrickxJan VanfleterenPeter Van Daele

Array waveguide sensor

Geert Van SteenbergeJ. MissineB. Van HoeK. Van CoillieJan VanfleterenPeter Van Daele

Assembly of Ultra-Thin Chip Packages (UTCPs) for enhanced flexibility of flexible displays

Jonathan GovaertsJan Vanfleteren

Design and Integration Technology for Miniature Medical Microsystems

C Van HoffH NevesA AartsF IkerP SoussanM GonzalezE BeyneJan VanfleterenR PuersP De Moor

Design and implementation of advanced systems on flexible-stretchable technology towards embedding textile

R CartaB JourandJ HermansF ThonéDominique BrosteauxFabrice AxisaJan VanfleterenB Puers

Design and manufacturing of stretchable high-frequency interconnects

Benoît HuygheHendrik RogierJan VanfleterenFabrice Axisa

A1 Journal Article in IEEE TRANSACTIONS ON ADVANCED PACKAGING

Design and performance of metal conductors for stretchable electronic circuits

M. GonzalezFabrice AxisaFrederick BossuytY. HsuB. VandeveldeJan Vanfleteren

Design of metal interconnects for stretchable electronic circuits

Mario GonzalezFabrice AxisaMathieu Vanden BulckeDominique BrosteauxBart VandeveldeJan Vanfleteren

A1 Journal Article in MICROELECTRONICS RELIABILITY

Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology

Jan VanfleterenFabrice AxisaDominique BrosteauxFrederick BossuytEva De LeersnyderThomas VervustBenoît HuygheJeroen MissinneRik VerplanckeMario Gonzalez

Embedding and assembly of ultrathin chips in multilayer flex boards

Wim ChristiaensThomas LoeherBarbare PahlMichael FeilBart VandeveldeJan Vanfleteren

A1 Journal Article in CIRCUIT WORLD

Flexible embedded active optical link

Erwin BosmanGeert Van SteenbergeNina HendrickxWim ChristiaensJan VanfleterenPeter Van Daele

Functionality and Reliability Testing of Bendable Ultrathin Chip Packages

Wim ChristiaensTom TorfsWim HuwelJan Vanfleteren

Interconnecting drivers to flexible displays

Jonathan GovaertsBjorn VandecasteeleJan Vanfleteren

A1 Journal Article in JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY

Laser based fast prototyping methodology of producing stretchable and conformable electronic systems

Fabrice AxisaFrederick BossuytThomas VervustJan Vanfleteren

Medium and atmospheric pressure plasma treatment for improvement of adhesion of PDMS used for flexible and stretchable electronics

Nathalie De GeyterRino MorentFabrice AxisaNele De SmetLéon GengembreEva De LeersnyderChristophe LeysJan VanfleterenMonika Rymarczyk-MachalEtienne Schacht

Multiple chip integration for flat flexible electronics

Jonathan GovaertsWim ChristiaensErwin BosmanJan Vanfleteren

Stretchable engineering technologies for the development of advanced stretchable polymeric systems

Fabrice AxisaFrederick BossuytJeroen MissinneRik VerplanckeThomas VervustJan Vanfleteren

The HOP sensor: wireless motion sensor

Bart KuykenWouter VerstichelFrederick BossuytJan VanfleterenMichiel DemeyMarc Leman

The musical synchrotron: using wireless motion sensors to study how social interaction affects synchronization with musical tempo

Michiel DemeyMarc LemanFrederick BossuytJan Vanfleteren

2007

Adhesion enhancement by a dielectric barrier discharge of PDMS used for flexible and stretchable electronics

Rino MorentNathalie De GeyterFabrice AxisaNele De SmetL GengembreEva De LeersnyderChristophe LeysJan VanfleterenMonika Rymarczyk-MachalEtienne Schacht et al.

A1 Journal Article in JOURNAL OF PHYSICS D-APPLIED PHYSICS

Adhesion enhancement by a dielectric barrier discharge of PDMS used for flexible and stretchable electronics

Nathalie De GeyterRino MorentFabrice AxisaEva De LeersnyderChristophe LeysJan VanfleterenNele De SmetMonika Rymarczyk-MachalEtienne Schacht

Advanced substrates and packages for wearable electronics and sensors

Jan VanfleterenHerbert De SmetJohan De BaetsAndré Van Calster

Biomedical stretchable sytems using MID based stretchable electronics technology

Fabrice AxisaDominique BrosteauxEva De LeersnyderFrederick BossuytJan VanfleterenB HermansR Puers

Design and fabrication of elastic interconnections for stretchable electronic circuits

Dominique BrosteauxFabrice AxisaM GONZALEZJan Vanfleteren

A1 Journal Article in IEEE ELECTRON DEVICE LETTERS

Design of metal interconnects for stretchable electronic circuits using finite element analysis

Mario GonzalesFabrice AxisaMathieu Vanden BulckeDominique BrosteauxBart VandeveldeJan Vanfleteren

Elastic and conformable electronic circuits and assemblies using MID in polymer

Fabrice AxisaDominique BrosteauxEva De LeersnyderFrederick BossuytM GonzalezM VandenbulckeJan Vanfleteren

Embedding of active components in multilayer flex boards

Wim ChristiaensT LOEHERM FEILB VANDEVELDEJan Vanfleteren

Embedding of chips in flex: a global optimisation from thermal, mechanical and electrical RF perspective

B VANDEVELDEL CHENS BREBELSWim ChristiaensJan Vanfleteren

Embedding of optical interconnections in flexible electronics

Erwin BosmanGeert Van SteenbergePeter GeerinckWim ChristiaensJan VanfleterenPeter Van Daele

Embedding of thinned chips in plastic substrates

Bjorn VandecasteeleJonathan GovaertsJan Vanfleteren

Flexible polyimide based ultra-thin chip package (UTCP)

Wim ChristiaensErwin BosmanWim HuwelWim PerduJan Vanfleteren

Flexible-substrate low-cost construction of a coplanar-waveguide aperture-coupled microstrip patch antenna

D DEPRETHendrik RogierKristof DhaenensJan Vanfleteren

A1 Journal Article in MICROWAVE AND OPTICAL TECHNOLOGY LETTERS

Integration of thin flexible RF structures into flexible PCB

Wim ChristiaensH BURKARDJ LINKJan Vanfleteren

Low cost elastic and conformable electronic circuits and assemblies using MID in stretchable polymer

Fabrice AxisaDominique BrosteauxEva De LeersnyderFrederick BossuytM GonzalezM Vanden BulckeJan Vanfleteren

Low cost, biocompatible elastic and conformable electronic technologies using MID in stretchable polymer

Fabrice AxisaDominique BrosteauxEva De LeersnyderFrederick BossuytM GonzalezNele De SmetEtienne SchachtMonika Rymarczyk-MachalJan Vanfleteren

Multimode optical interconnections embedded in flexible electronics

Erwin BosmanGeert Van SteenbergeNina HendrickxPeter GeerinckWim ChristiaensJan VanfleterenPeter Van Daele

Polyimide based embedding technology for RF structures and active components

Wim ChristiaensB VANDEVELDES BREBELSJan Vanfleteren

Stretchable conductor technology for elastic electronic systems

Johan De BaetsFabrice AxisaDominique BrosteauxM GonzalezT LoeherD ManessisR HeinrichB SchmiedA OstmannJan Vanfleteren

2006

(Flat) Ultra-thin chip package

Wim ChristiaensBart VandeveldeJan Vanfleteren

A flexible polyimide based circuit for rapid heating of small objects

Bjorn VandecasteeleKristof DhaenensWim ChristiaensLieven DegrendeleM STEELA VAN LIEREJan Vanfleteren

Elastic interconnects for stretchable electronic circuits using MID (moulded interconnect device) technology

Dominique BrosteauxFabrice AxisaJan VanfleterenNadine CarchonM GONZALEZ

Embedding active components as a 3D packaging solution

Maarten CauweWim ChristiaensJan VanfleterenJohan De Baets

A2 Journal Article in Advancing Microelectronics

Optical connections on flexible substrates

Erwin BosmanPeter GeerinckWim ChristiaensGeert Van SteenbergeJan VanfleterenPeter Van Daele

Optical interconnections embedded in flexible substrates

Erwin BosmanWim ChristiaensPeter GeerinckGeert Van SteenbergeJan VanfleterenPeter Van Daele

Optical interconnections embedded in flexible substrates

Erwin BosmanWim ChristiaensPeter GeerinckGeert Van SteenbergeJan VanfleterenPeter Van Daele

Stretchable electronic systems

T LOHERD MANESSISR HEINRICHB SCHMIEDJan VanfleterenJohan De BaetsA OSTMANNH REICHL

Technologies for highly miniaturized autonomous sensor networks

K BAERTB GYSELINCKXT TORFSV LEONOVF YAZICIOGLUS BREBELSS DONNAYJan VanfleterenE BEYNEC VAN HOOF

A1 Journal Article in MICROELECTRONICS JOURNAL

UTCP: 60 µm thick bendable package

Wim ChristiaensBart VandeveldeErwin BosmanJan Vanfleteren

Ultra-thin chip package (UTCP) for flexible electronics applications

Wim ChristiaensBart VandeveldeJan Vanfleteren

Ultra-thin chip package using embedding in spin-on polyimides

Wim ChristiaensErwin BosmanJan Vanfleteren

A4 Journal Article in GOOD-DIE NEWSLETTER

Ultra-thin chip package using embedding in spin-on polyimides

Wim ChristiaensErwin BosmanJan Vanfleteren

2005

Advanced Technologies in Fabrication and Interconnection of Flexible Displays and Substrates

Tom BertJan VanfleterenBjorn VandecasteeleStefaan MaeyaertJan DoutreloigneJonathan GovaertsHerbert De SmetAndré Van Calster

Embedded ultra-thin chips in flex

Wim ChristiaensMichael FeilThomas LoeherJan Vanfleteren

FP5-CSG-IMECAT: Introduction and Highlights of an EC funded Project on Lead-Free Materials and Assembly Development Technologies

Jan Vanfleteren

Lead-free flip chip: a comparison between lead-free solder and adhesives

Bjorn VandecasteeleJan VanfleterenD MANESSISA OSTMANNH HAGEDORNJ WIESE

Thermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications

M GONZALEZB VANDEVELDEJan VanfleterenD MANESSIS

2004

Low temperature flip chip attachment for flexible display applications

Bjorn VandecasteeleJ MAATTANENTomas PodprockyJan Vanfleteren

Tiheiden joustaville alustoille tehtyjen kääntösiruliitosten testausohjelma ja tulokset - reliability results of high density flip chip on flex assemblies

J MAATTANENBjorn VandecasteeleJan VanfleterenY DE MAQUILLE

2003

Comparison of different flex materials in high density flip chip on flex applications

P PALMJ MAATTANENY DE MAQUILLEA PICAULTJan VanfleterenBjorn Vandecasteele

A1 Journal Article in MICROELECTRONICS RELIABILITY

Integrated optics in a standard MCM-D motherboard technology demonstrated i O/E measurement probes

Herbert De PauwJohan De BaetsJan VanfleterenAndré Van Calster

Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes

Herbert De PauwJohan De BaetsJan VanfleterenAndré Van Calster

Low temperature flip chip with adhesives on PES

Bjorn VandecasteeleTomas PodprockyJan VanfleterenJ MAATTANEN

Packaging research goes lead-free

E PARTONM GONZALEZR LABIEB VANDEVELDEJan VanfleterenP RATCHEV

A4 Journal Article in Printed Circuit Europe

Response to 'Comment on the paper 'Method for measuring the cell gap in liquid-crystal displays''

Filip BruyneelHerbert De SmetJan VanfleterenAndré Van Calster

Editorial material

Results of a high density flip chip on flex reliability test program

Bjorn VandecasteeleJan VanfleterenJ MAATTANENT LAITINENY DE MAQUILLE

2002

An O/E measurement probe based on an optics-extended MCM-D motherboard technology

Herbert De PauwJohan De BaetsJan VanfleterenAndré Van Calster

High density flip chip with adhesives on ceramics.

B VANDECASTEELETomas PodprockyJan Vanfleteren

Low temperature flip-chip process using ICA and NCA (Isotropically and non-conductive adhesive) for flexible displays application

Jan VanfleterenBjorn VandecasteeleTomas Podprocky

Reduced temperature flip-chip technologies on flexible display substrates using adhesives

Jan VanfleterenBjorn VandecasteeleS RAEVENSJ MAATTANENP PERTTULA

2001

Assembly of reflective PDLC microdisplays

Filip BruyneelHerbert De SmetJan VanfleterenAndré Van Calster

Cell gap optimization and alignment effects in reflective PDLC microdisplays.

Filip BruyneelHerbert De SmetJan VanfleterenAndré Van Calster

A1 Journal Article in LIQUID CRYSTALS

Laser via generation into flexible substrates

Zsolt Illyefalvi-VitezRichárd BerényiPéter GordonJános PinkolaMiklós RuszinkóJan Vanfleteren

Low temperatue flip-chip assembly for biomedical applications.

Jan VanfleterenB VANDECASTEELETomas PodprockyP JACOBS

Method for measuring the cell gap in liquid-crystal displays.

Filip BruyneelHerbert De SmetJan VanfleterenAndré Van Calster

A1 Journal Article in OPTICAL ENGINEERING

Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations

Herbert De PauwJan VanfleterenJohan De BaetsAndré Van Calster

Reliability of different flex materials in high density flip chip on flex applications

P PALMJ MAATTANENY DE MAQUILLEA PICAULTJan VanfleterenBjorn Vandecasteele

2000

An MCM-D laser driver hybrid with RF amplifier chip, combining advanced FC assembly and novel single chip bumping technology.

Herbert De PauwJan VanfleterenHerbert De SmetSuixin ZhangAndré Van Calster

Characteristics of PNLC in reflective displays

Filip BruyneelHerbert De SmetJan VanfleterenAndré Van CalsterToru FujisawaM Aizawa

Electro-conductive adhesives for high density package and flip-chip interconnections.

D WOJCIECHOWSKIJan VanfleterenE REESEHW HAGEDORN

A1 Journal Article in MICROELECTRONICS RELIABILITY

Extension of a multilayer interconnection technology in MCM-Si with opto-electronic facilities.

Herbert De PauwHerbert De SmetJan VanfleterenJo LernoutAndré Van Calster

A1 Journal Article in MICROELECTRONICS RELIABILITY

Highlights of the DACTEL project: Development of Adhesive Chip Technologies for Dedicated Electronic Applications.

Jan VanfleterenAlfons VervaetAndré Van Calster

1999

A hybrid thin-film laser driver module for RF frequency with a full-custom C07 analog driver amplifier.

Herbert De PauwJan VanfleterenHerbert De SmetSuixin ZhangAndré Van Calster

A silicon based reflective polymer dispersed LC display for portable low power applications.

Geert Van DoorselaerNadine CarchonJean Van Den SteenDieter CuypersJan VanfleterenHerbert De SmetAndré Van Calster

Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies.

Jan VanfleterenJohan De BaetsAndré Van CalsterG SCHOLSN PERGOOTE JARVINENA AINTILA

1998

A Reflective Polymer Dispersed Information Display made on CMOS

Geert Van DoorselaerNadine CarchonJ VANDENSTEENDieter CuypersJan VanfleterenHerbert De SmetAndré Van Calster

A five-layer thin film MCM-Si design using oxynitride dielectrics

Jo LernoutJan VanfleterenAndré Van CalsterG Schols

A paper-white chip-based display MCM package for portable IT products

Geert Van DoorselaerB DobbelaereM VranaX XieNadine CarchonJean Van Den SteenJan VanfleterenHerbert De SmetDieter CuypersAndré Van Calster

Characterisation of a paper-white reflective PDLC microdisplay for portable IT applications

Geert Van DoorselaerNadine CarchonJean Van den SteenJan VanfleterenHerbert De SmetDieter CuypersAndré Van Calster

Design and fabrication of a two layer thin film interconnection system on glass for use in a parallel free-space optical interconnection demonstrator

Jo LernoutJan VanfleterenAndré Van CalsterLuc VanwassenhovePeter Van Daele

Flip Chip Attachment using Adhesives

Jan Vanfleteren

Multilayer motherboard technology in MCM-Si with opto-electronic features.

Herbert De PauwHerbert De SmetJan VanfleterenJo LernoutAndré Van Calster

New adhesives for high density flip-chip interconnection

Dominique WojciechowskiJan VanfleterenE REESEH HAGEDORN

New adhesives for high density flip-chip interconnections

Dominique WojciechowskiJan VanfleterenE REESEH HAGEDORN

1997

A Five Layer Thin Film MCM-Si Design using Oxynitride Dielectrics

Jo LernoutJan VanfleterenAndré Van CalsterG SCHOLS

Fine Pitch Interconnection using Anisotropie Conducting Adhesives

E REESEJan Vanfleteren

Technology and circuit aspects of reflective PNLC microdisplays

Jean Van Den SteenNadine CarchonGeert Van DoorselaerChristof De BackereJohan De BaetsHerbert De SmetJoeri De VosJo LernoutJan VanfleterenAndré Van Calster et al.

1996

A Low-Cost TAB Interconnection technology for LCD Drivers

A DravetP KerteszS SechezAndré Van CalsterJan VanfleterenM DecaluweK DeckelmannJ WieseG Schols

Development of an adhesive TAB joining technology

Jan VanfleterenAndré Van CalsterKris SabbeM DE CALUWEA DRAVETP KERTESZS SECHERK DECKELMANNJ WIESEE CORTES et al.

1995

A new cost-effective TAB technology for small and medium volumes

A DRA VETS SECHEZAndré Van CalsterJohan De BaetsJan VanfleterenKoenraad AllaertP VETTERM FORRESTG SCHOLSK DECKELMANN et al.

Modelling poly-CdSe TFTs for AMLCD

Johan De BaetsAndré Van CalsterAnn De CubberHerbert De SmetJan Vanfleteren

Modelling poly-CdSe TFTs for AMLCD

Johan De BaetsAndré Van CalsterAnn Marie De CubberHerbert De SmetJan Vanfleteren

New model for the characterization and simulation of TFTs in all operating regions

Herbert De SmetJohan De BaetsAM DE CUBBERJoeri De VosAndré Van CalsterJan Vanfleteren

A2 Journal Article in Journal of the Society for Information Display, Vol. 3, No. 3, december

1994

A simplified 3-step fabrication scheme for high mobility AMLCD panels

André Van CalsterAnn De CubberJohan De BaetsHerbert De SmetJan Vanfleteren

Analysis of transient photoconductivity in CdSe:Cu:Cl thin films

Jan CaponJohan De BaetsAnn Marie De CubberHerbert De SmetAndré Van CalsterJan Vanfleteren

A1 Journal Article in PHYSICA STATUS SOLIDI A-APPLIED RESEARCH

1993

A lensless contact-type image sensor-based on a CdSe photoconductive array

Jan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan Vanfleteren

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

A polymer-network liquid-crystal poly-CdSe-TFT active-matrix display

Johan De BaetsJan CaponI De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan VanfleterenT FujisawaH OgawaH Takatsu

A2 Journal Article in JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY

Hysteresis phenomena in active matrix adressed polymer network Liquid Crystal Displays

Johan De BaetsJan CaponAnn De CubberHerbert De SmetAndré Van CalsterJan VanfleterenT FujisawaH OgawaM AizawaH Takatsu

1992

Active matrix design for polymer network liquid crystal projection displays

Johan De BaetsAndré Van CalsterJan CaponIgor De RyckeHerbert De SmetJan DoutreloigneJan VanfleterenToru FujisawaH OgawaH Takatsu

CdSe thin film transistors for the addressing of liquid crystal displays

André Van CalsterJan VanfleterenJan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan Doutreloigne

CdSe-based thin-film integrated optical sensors

Jan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan Vanfleteren

A1 Journal Article in SENSORS AND ACTUATORS A-PHYSICAL

Silicon oxynitride layers for device passivation

Johan De BaetsAndré Van CalsterJan CaponIgor De RyckeHerbert De SmetJan DoutreloigneJan VanfleterenGeert NachtergaeleSylvain Demolder

Thin-film cadmium selenide technology in large area active matrix high resolution displays

Jim FarrellMike WestcottAndré Van CalsterJohan De BaetsIgor De RyckeJan CaponHerbert De SmetJan DoutreloigneJan Vanfleteren

A1 Journal Article in MICROELECTRONIC ENGINEERING

1991

A polymer network liquid crystal poly-CdSe TFT active matrix display

Johan De BaetsJan CaponI De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan VanfleterenJ FujisawaH Ogawa

CdSe based thin film integrated optical sensors

Jan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterJan Vanfleteren

Evaluation of a 64x64 CdSe TFT addressed ACTFEL display demonstrator

Jan VanfleterenJan CaponJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterPatrick De VisschereK SallmenR Graeffe

Failure mechanisms in dielectrics

R Vanden BergheS DemolderM SailleKoenraad AllaertAnita De BruyckerJohan De BaetsAndré Van CalsterJan VanfleterenIgor De RyckeHerbert De Smet et al.

1990

2-MHz clocked LCD drivers on glass

Igor De RyckeAndré Van CalsterJan VanfleterenJohan De BaetsJan DoutreloigneHerbert De SmetPeter Vetter

A1 Journal Article in IEEE JOURNAL OF SOLID-STATE CIRCUITS

A correlation between I/F-noise and short-term drift in poly-CdSe- in thin-film transistors

Jan DoutreloigneJohan De BaetsIgor De RyckeHerbert De SmetAndré Van CalsterJan Vanfleteren

Complementary CdSe In/Ge Cu TFT circuits for integrated display drivers

Jan DoutreloigneHerbert De SmetJohan De BaetsIgor De RyckeAndré Van CalsterJan Vanfleteren

Design of a prototype active matrix CdSe TFT addressed EL display

Jan VanfleterenJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneAndré Van CalsterPatrick De VisschereK SallmenR Graeffe

High-voltage polycrystalline CdSe thin-film transistors

Johan De BaetsJan VanfleterenIgor De RyckeJan DoutreloigneAndré Van CalsterPatrick De Visschere

A1 Journal Article in IEEE TRANSACTIONS ON ELECTRON DEVICES

The electrical performance of a complementary CdSe:In/Ge:Cu thin film transistor technology for flat panel displays

Jan DoutreloigneJohan De BaetsIgor De RyckeHerbert De SmetAndré Van CalsterJan Vanfleteren

A1 Journal Article in SOLID-STATE ELECTRONICS

The influence of low copper-doping concentrations on the recrystallisation process in and the electrical-properties of germanium in Ge-Cu thin-film transistors

Jan DoutreloigneJohan De BaetsIgor De RyckeHerbert De SmetAndré Van CalsterJan Vanfleteren

A1 Journal Article in THIN SOLID FILMS

Thin film transistors for flat screen displays

André Van CalsterJohan De BaetsIgor De RyckeHerbert De SmetJan DoutreloigneJan Vanfleteren

A2 Journal Article in ALTA FREQUENZA : RIVISTA DI ELETTRONICA

1988

On the field effect in polycrystalline CdSe thin-film transistors

André Van CalsterJan VanfleterenI De RyckeJohan De Baets

A1 Journal Article in JOURNAL OF APPLIED PHYSICS

Polycrystalline CdSe films for thin film transistors.

André Van CalsterAlfons VervaetIgor De RyckeJohan De BaetsJan Vanfleteren

A1 Journal Article in JOURNAL OF CRYSTAL GROWTH

1987

A new technology for fast switching-circuits on glass

André Van CalsterIgor DeRyckeAlfons VervaetJohan De BaetsJan Vanfleteren

A1 Journal Article in IEEE ELECTRON DEVICE LETTERS

Digitale schakelingen met poly-CdSe dunne film transistoren

Jan VanfleterenHerman PauwelsAndré Van Calster

1986

A comparative-study of evaporated Al2O3, SiO2 and SiO2: Al2O3 thin-films

Jan VanfleterenAndré Van Calster

A1 Journal Article in THIN SOLID FILMS

1985

A 4-vacuum-cycle lift-off process for the polycristalline CdSe thin-film transistor

Jan VanfleterenAndré Van Calster

A1 Journal Article in IEEE ELECTRON DEVICE LETTERS

Active matrix with integrated drivers on soda-lime glass using poly-CdSe and poly-Ge. Journal of the SID, Vol. 1/4, pp. 423-428, 1993.

Herbert De SmetJan CaponJohan De BaetsI DE RUCKEJan DoutreloigneAndré Van CalsterJan Vanfleteren

A2 Journal Article

Anisotropie Conductive Adhesives for High Density Interconnections. Proc. of the lste Eur. Conf. on Electron. Packaging Techn., DVS, pp. 66-68, 1994.

André Van CalsterJohan De BaetsJan VanfleterenA DRAVETKoenraad AllaertE CORTESK DECKELMANG SCHOLS

CdSe Thin Film Transistors for the Adressing of Liquid Crystal Displays. Voorgesteld op de 'Summer European Liquid Crystal Conference', Vilnius, Lithouwen, 1991.

André Van CalsterJan VanfleterenJan CaponJohan De BaetsI DE RYCKEHerbert De SmetJ DOUTERLOIGNE

Generalised TFT-Model for 4-Quadrant Simulations. Proc. of the 3rd Int. CdSe Workshop, Strasbourg, 1993.

Herbert De SmetJan CaponJohan De BaetsAnn De CubberAndré Van CalsterJan Vanfleteren

Geometric Design of Lensless Photoconductive Cotact-type Image Sensors. Journal of the SID, Vol. 1, Nr. 2, pp. 233-241, 1993.

Jan CaponJohan De BaetsI DE RYCKEHerbert De SmetJan DoutreloigneAndré Van CalsterJan Vanfleteren

A2 Journal Article

On the Physical Properties of a New HVTFT Design. Proc. of the 3rd Int. CdSe Workshop, Strasbourg, 1993.

André Van CalsterJohan De BaetsAnn De CubberJan CaponHerbert De SmetJan Vanfleteren

Thin Film Technologies for High Density Active Matrix Adressed Displays. Proc. of the 9th European Hybrid Microelectronics Conf., pp. 84-90, Nice, 1993.

André Van CalsterJohan De BaetsAnn De CubberHerbert De SmetJan CaponJan VanfleterenJ FARELLM WESTCOTT