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Researcher
Herbert De Pauw
Profile
Projects
Publications & Research Data
Activities
Awards & Distinctions
Patents
35
Results
2026
Prevalence and factors associated with neonatal hypothermia in Sub-Saharan Africa : systematic review and meta-analysis
Hundessa Daba Nemomssa
Frederick Bossuyt
Bjorn Vandecasteele
Herbert De Pauw
Netsanet Workneh Gidi
Pieter Bauwens
A1
Journal Article
in
JOURNAL OF CLINICAL MEDICINE
2026
2025
Development of 3D-formed textile-based electrodes with flexible interconnect ribbon
Paula Veske-Lepp
Glenn Van Steenkiste
Svea Thienpondt
Joris Cools
Herbert De Pauw
Frederick Bossuyt
A1
Journal Article
in
SENSORS
2025
Modeling and analysis of terminal capacitances in high-power devices : application to p-GaN gate HEMTs
Mojtaba Alaei
Herbert De Pauw
Elena Fabris
Stefaan Decoutere
Jan Doutreloigne
Johan Lauwaert
Benoit Bakeroot
A1
Journal Article
in
IEEE TRANSACTIONS ON ELECTRON DEVICES
2025
Revolutionizing patient care : a comprehensive review of recent advances in flexible printed heaters for wearable medical applications
Hundessa Daba Nemomssa
Frederick Bossuyt
Bjorn Vandecasteele
Herbert De Pauw
Netsanet Workneh Gidi
Pieter Bauwens
A1
Journal Article
in
ACTUATORS
2025
2024
GaN power devices on 200 mm engineered substrates
Benoit Bakeroot
Karen Geens
Sujit Kumar
Herbert De Pauw
Matteo Borga
Anurag Vohra
Urmimala Chatterjee
Stefaan Decoutere
C3
Conference
2024
Taking GaN to the next level of 100 V to 2000 V and beyond scalability with the revolutionary 200 mm and 300 mm QST® manufacturing platform
C. Basceri
V. Odnoblyudov
C. Kurth
M. Yamada
S. Konishi
M. Kawahara
C.-C. Liao
S. Shen
J. Chiu
K. Geens
et al.
C1
Conference
2024
2023
A fully integrated half-bridge driver circuit in All-GaN GAN-IC technology
Urmimala Chatterjee
Herbert De Pauw
Olga Syshchyk
Thibault Cosnier
Anurag Vohra
Stefaan Decoutere
A1
Journal Article
in
SOLID-STATE ELECTRONICS
2023
Substrate network modeling for lateral p-GaN gate HEMTs in a 200V GAN-IC platform
Mojtaba Alaei
Herbert De Pauw
Urmimala Chatterjee
Stefaan Decoutere
Johan Lauwaert
Benoit Bakeroot
C1
Conference
2023
2020
A high-efficiency charge pump with charge recycling scheme and finger boost capacitor
Hui Peng
Herbert De Pauw
Pieter Bauwens
Jan Doutreloigne
A1
Journal Article
in
INTEGRATION-THE VLSI JOURNAL
2020
A monolithic low-power-consumption driver circuit based on a Dickson charge pump for MEMS actuator applications
Hui Peng
Herbert De Pauw
Pieter Bauwens
Jan Doutreloigne
A1
Journal Article
in
SOLID-STATE ELECTRONICS
2020
Implementation of a 16-phase 8-branch charge pump with advanced charge recycling strategy
Hui Peng
Pieter Bauwens
Herbert De Pauw
Jan Doutreloigne
A1
Journal Article
in
IEICE TRANSACTIONS ON ELECTRONICS
2020
2019
A 16-phase 8-branch charge pump with advanced charge recycling strategy
Hui Peng
Pieter Bauwens
Herbert De Pauw
Jan Doutreloigne
P1
Conference
2019
A high-efficiency and compact charge pump with charge recycling scheme and finger boost capacitor
Hui Peng
Pieter Bauwens
Herbert De Pauw
Jan Doutreloigne
C1
Conference
2019
A monolithic high-voltage driver circuit based on a Dickson charge pump for MEMS actuator applications
Hui Peng
Herbert De Pauw
Pieter Bauwens
Jan Doutreloigne
A2
Journal Article
in
INTERNATIONAL JOURNAL OF CIRCUITS, SYSTEMS AND SIGNAL PROCESSING
2019
2014
Automatic load-based MOSFET segmentation for switching DC-DC converters
Jindrich Windels
Ann Monté
Herbert De Pauw
Jan Doutreloigne
P1
Conference
2014
2012
A synchronous rectifier for isolated forward DC-DC converters, integrated in a high-voltage smart-power IC technology
Jan Doutreloigne
Herbert De Pauw
C1
Conference
2012
An active clamping H-bridge for isolated forward DC-DC converters, integrated in a high-voltage smart-power IC technology
Jan Doutreloigne
Herbert De Pauw
C1
Conference
2012
2011
Design and optimization of innovative and area-efficient splitter implementations for ADSL applications
Herbert De Pauw
Jan Doutreloigne
Dissertation
2011
2010
Development of the area-reducing active 'coil-enhancement' principle, practised onto an ADSL-POTS splitter
Herbert De Pauw
Vincent De Gezelle
Jan Doutreloigne
André Van Calster
Edmond Op de Beeck
Rens Van Bolderik
Jurgen Content
A1
Journal Article
in
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS
2010
Introduction of a pseudo-6th order ISDN splitter with bandstop topology
Herbert De Pauw
Jan Doutreloigne
André Van Calster
Edmond Op de Beeck
Jurgen Content
C1
Conference
2010
2009
Active-tunable inductor effected by a novel impedance synthesis
Herbert De Pauw
Vincent De Gezelle
Jan Doutreloigne
Edmond Op de Beeck
Rens Van Bolderik
Jurgen Content
P1
Conference
2009
Comparative study on the effects of PVT variations between a novel all-MOS current reference and alternative CMOS solutions
Jindrich Windels
Christophe Van Praet
Herbert De Pauw
Jan Doutreloigne
P1
Conference
2009
2007
See-through passive anti ferro electric helmet-mounted liquid crystal display
X QUINTANA
JM OTON
N BENNIS
Herbert De Smet
Herbert De Pauw
R DABROWSKI
P KULA
MA GEDAY
P1
Conference
2007
2006
A full-custom 300-channel high-voltage display driver in an 80V 0.35 µm CMOS intelligent interface technology
Herbert De Pauw
Jan Doutreloigne
Herbert De Smet
André Van Calster
P1
Conference
2006
Mjollnir: a 300-output cascadeable high-voltage display driver
Herbert De Pauw
Jan Doutreloigne
Herbert De Smet
André Van Calster
C1
Conference
2006
2004
Redistribution on wafer: an alternative, cost-efficient approach
Herbert De Pauw
Nadine Carchon
Johan De Baets
André Van Calster
C1
Conference
2004
2003
Integrated optics in a standard MCM-D motherboard technology demonstrated i O/E measurement probes
Herbert De Pauw
Johan De Baets
Jan Vanfleteren
André Van Calster
C1
Conference
2003
Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes
Herbert De Pauw
Johan De Baets
Jan Vanfleteren
André Van Calster
P1
Conference
2003
2002
An O/E measurement probe based on an optics-extended MCM-D motherboard technology
Herbert De Pauw
Johan De Baets
Jan Vanfleteren
André Van Calster
P1
Conference
2002
2001
Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations
Herbert De Pauw
Jan Vanfleteren
Johan De Baets
André Van Calster
P1
Conference
2001
2000
An MCM-D laser driver hybrid with RF amplifier chip, combining advanced FC assembly and novel single chip bumping technology.
Herbert De Pauw
Jan Vanfleteren
Herbert De Smet
Suixin Zhang
André Van Calster
P1
Conference
2000
Extension of a multilayer interconnection technology in MCM-Si with opto-electronic facilities.
Herbert De Pauw
Herbert De Smet
Jan Vanfleteren
Jo Lernout
André Van Calster
A1
Journal Article
in
MICROELECTRONICS RELIABILITY
2000
1999
A hybrid thin-film laser driver module for RF frequency with a full-custom C07 analog driver amplifier.
Herbert De Pauw
Jan Vanfleteren
Herbert De Smet
Suixin Zhang
André Van Calster
P1
Conference
1999
Active matrix vacuum fluorescent display with CdSe: In TFTs
J. De Vos
S Stoukatch
Herbert De Pauw
Herbert De Smet
P1
Conference
1999
1998
Multilayer motherboard technology in MCM-Si with opto-electronic features.
Herbert De Pauw
Herbert De Smet
Jan Vanfleteren
Jo Lernout
André Van Calster
P1
Conference
1998