Electircal analysis and compensation design for Gbps packaging interconnections

01 January 2009 → 31 October 2009
Regional and community funding: Special Research Fund
Research disciplines
  • Engineering and technology
    • Electronics
packaging high frequencies interconnect modelling
Project description

In a sabbatical stay of 6 months a visiting professor from the National Taiwan University will be involved in a joint research project dealing with the modelling and optimisation of high speed packaging interconnects for Gbps applications. Model order reduction techniques will be used to come to compact models and optimised eye diagrams.