Heterogeneous integration is a hot topic in realizing advanced micro-systems, both in the field of electronics and photonics. It allows the separate manufacturing of small chiplets, that are then efficiently combined to build powerful systems. This enables reducing the innovation cycle time, allows for IP reuse and provides a sustainable path forward for system integration. In the Photonics Research Group we are establishing a micro-transfer printing pilot line to enable a very scalable path to chiplet integration. This involves a whole train of tools to do the patterning, deposition and chiplet integration on a 200mm wafer-scale. The performance of the assembled micro-systems depends strongly on the control of the layer thicknesses of different dielectric layers deposited (and etched) in the process. A tool is necessary that can map these layer thicknesses in an automated way over the full wafer. With this project we want to acquire such a system, to complete the micro-transfer printing pilot line.