Heterogeneous integration is a hot topic in realizing advanced micro-systems, both in the field of electronics and photonics. It allows the separate manufacturing of small chiplets, that are then efficiently combined to build powerful systems. This enables reducing the innovation cycle time, allows for IP reuse and provides a sustainable path forward for system integration. In the Photonics Research Group we are establishing a micro-transfer printing pilot line to enable a very scalable path to chiplet integration. This involves a whole train of tools to do the patterning, deposition and chiplet integration on a 200mm wafer-scale. At the end of the line, there is a need for annealing the assembled systems-on-chip to enable a low resistance interconnection to the chiplets. Currently, our lab only has access to a sample-scale rapid thermal annealing system (RTA) for this purpose. With this project we want to acquire a 200mm RTA system, to complete the micro-transfer printing pilot line.