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Project
Advanced Differential Surface Admittance Operator Formulations for the Modeling of On-Printed Circuit Board, On-Interposer, and On-Chip Interconnect Structures
Information
Project Team
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Publications & research data ( 2 )
Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures
Tim Pattyn
Xiao Sun
Eric Beyne
Daniël De Zutter
Martijn Huynen
Dries Vande Ginste
C1
Conference
2025
Broadband electromagnetic modeling of on-chip passives using a differential surface admittance operator for 3-D piecewise homogeneous structures
Tim Pattyn
Xiao Sun
Eric Beyne
Daniël De Zutter
Martijn Huynen
Dries Vande Ginste
A1
Journal Article
in
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
2025
Activities ( 0 )
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Patents ( 0 )