In the last decade, the average number of electronic devices per person has increased drastically. In the meantime, due to the rapid development of new technology, the lifespan of those devices has been considerably reduced, which is causing serious increases in e-waste. In this context, the aim of this research proposal is the implementation of dynamic chemistries in electronic devices to ease the disassembly and recycling of such e-waste, while being compatible with actual fabrication processes. More specifically, thermoreversible, flame retardant and highly stable epoxy-polyamide based curing agents, which aim to mechanically support and bond the conductive layers in electronic devices, will be developed and introduced in printed circuit boards (PCBs) to recover valuable metals such as copper. Specific attention will be given to a biobased, flame-resistant epoxy derivative of resveratrol.
The first emphasis will be on the synthesis of tailor-made curing agents, primers, and the mixing of various fillers and fibers. Then, when applying them both in the bulk (in the composite) and/or at the interface, the heat-debonding will be studied during component disassembly with the final aim to create, in collaboration with the UGent department of electronics, various demonstrators that meet important requirements such as a strong mechanical strength during use, fast disassembly (within minutes) after use, and compatibility with current assembly steps.