Code
174IW606
Duration
01 January 2007 → 31 December 2008
Funding
Regional and community funding: various
Promotor
Research disciplines
-
Engineering and technology
- Nanotechnology
- Design theories and methods
Keywords
photonics
wafer bonding
electronics
Project description
The goal of this project is to develop cost efficient methods for the integration of optical and electronic systems by wafer bonding.