Code
01D26319
Duration
01 October 2019 → 01 November 2019
Funding
Regional and community funding: Special Research Fund
Promotor
Fellow
Research disciplines
-
Engineering and technology
- Analogue, RF and mixed signal integrated circuits
- Microwaves, millimeter waves and THz components and circuits and systems
Keywords
Optical communication systems
high-speed electronics
analog electronics
chip design
Project description
Continued pressure on data centers is driving a need for higher capacity, lower cost transceivers. This project will break through the 100Gbaud barrier through the design of traveling wave equalizers. A new assembly technique called “micro transfer printing” will allow an order of magnitude reduction of the production costs w.r.t. the state-of-the-art.