Research Explorer

Project

Platform for Advanced 3D-Stacked Image Sensors (3SIS)
Code
HGA179P0113
Duration
01 January 2010 → 31 December 2013
Funding
Regional and community funding: IWT/VLAIO
Research disciplines
  • Humanities and the arts
    • Theory and methodology of archaeology
Keywords
3D-Stacked Image Sensors
 
Project description
 

The goal of this project is to develop a generic platform consisting of both process technology modules as well as design techniques to enable a multitude of future silicon-based image sensor applications.