The proposed project will study, design and ultimately test novel optical modulators for realizing the next generation high-speed coherent transceivers, to be employed in data centers. The recent explosion in demand for more computing power in these data centers is driving operators to demand ever larger transceiver capacities. Micro transfer printing technology will be used to integrate III-V (InP-based) modulator coupons onto a Silicon Photonic platform. This allows scaling up the capacity while also increasing integration density and energy efficiency, in an economically scalable manner. The goal is to realize a transfer printable III-V modulator structure with electro-optic modulation bandwidth exceeding 100 GHz through careful electro-optic co-design with existing driver electronics, detectors and receiver electronics. Mach-Zhender interferometric structures as well as electro-absorption modulators will be explored. In addition to this bottom-up approach, a top-down approach will be conducted, starting from system-level specifications, where different transceiver architectures and modulation formats will be explored. By iterating between these two approaches, the optimal transceiver architecture and associated integrated modulator design will be determined, depending on the application. Finally, the developed designs will be tested using high-speed measurement equipment and IMDD and coherent testbeds.