Hybrid III-V/Si(N) multi-wavelength lasers for next-generation optical interconnects

01 February 2022 → 31 January 2024
Regional and community funding: various
Research disciplines
  • Engineering and technology
    • Optical fibre communications
hybrid integration multi wavelength lasers optical interconnect
Project description

The feasibility of advanced hybrid flip-chip multi-wavelength III-V/Si(N) laser concepts will be assessed using a wide range of simulation and modelling tools, both on the device and circuit level.

Test vehicles with the most promising approaches to realize advanced laser sources with high wavelength channel count (>16), and high efficiency enabling power-efficient, high-bandwidth short-reach optical interconnects will be designed and laid out.

Fabricated devices will be characterized and the results compared to device models. The results will be used to improve the device design.