Project

High Speed Communication Links Based on Heterogeneous Chips

Acronym
COMb
Code
41M00122
Duration
01 August 2022 → 31 January 2024
Funding
European funding: framework programme
Principal investigator
Research disciplines
  • Engineering and technology
    • Photonics, light and lighting
Keywords
laser
Other information
 
Project description

Optical links help connect the world. However, state-of-the-art optical-link technologies are struggling as people and businesses consume increasing amounts of information. Optical transceivers (which transmit and receive data) are particularly burdened as transmission rates intensify and data formatting techniques become more complex. The EU-funded COMb project has a plan: use a high-performing, cost-effective silicon nitride platform to integrate indium phosphide and lithium niobate — two key materials used extensively in telecommunications — and make ultra-high-speed transceivers. COMb will use many lines and the mode-lock technique so that lasers produce extremely fast pulses of light to transmit higher data rates and obtain higher symbol rates.

 
 
 
Disclaimer
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the European Research Council Executive Agency (ERCEA). Neither the European Union nor the authority can be held responsible for them.