Type
Equipment
Acronym
Tresky
Code
APP/00308
Date of commissioning
01 January 2008 → …
Research disciplines
-
Engineering and technology
- Semiconductor devices, nanoelectronics and technology
Keywords
die attach
flip-chip bonding
adhesive bonding
Brand Name/manufacturer
Tresky T-3200
Other information
Description
Die and flip-chip bonder for the assembly of bare-die components with and accuracy of ± 5 μm.