Infrastructure

Wedge bonder

Type
Equipment
Acronym
Wedge bonder
Code
APP/00307
Date of commissioning
01 January 2000 → …
Research disciplines
  • Engineering and technology
    • Semiconductor devices, nanoelectronics and technology
Keywords
hybrid assembly microwave device packaging wire bonding deep access bonding wedge bonding
Brand Name/manufacturer
Kulicke & Soffa 4523
Other information
 
Description

The Kulicke & Soffa 4523 is a manual wedge bonder for aluminium and gold wire, supporting deep access and fine wire bonding (down to 18 µm). It’s ideal for applications ranging from chip-on-board to complex microwave devices, offering precise control for short, low-loop wires and deep cavity bonding.