Type
Equipment
Acronym
Finetech
Code
APP/00264
Date of commissioning
01 January 2011 → …
Research disciplines
-
Natural sciences
- Photonics, optoelectronics and optical communications
Keywords
micro-assembly
chip placement
die bonding
precision assembly
Brand Name/manufacturer
FINE TECH Lambda
Other information
Description
Accurate (±1 micrometer) placement of chips and other 3D-structures.