Type
Equipment
Acronym
LAP expose
Code
APP/00334
Date of commissioning
01 July 2012 → …
Research disciplines
-
Engineering and technology
- Semiconductor devices, nanoelectronics and technology
Keywords
double-sided alignment
PCB imaging
UV exposure
photolithography
Brand Name/manufacturer
Bungard EXP 8000
Other information
Description
A double-sided UV exposure unit for precise imaging of photoresist-coated PCBs. It uses powerful mercury halide lamps and vacuum hold-down to ensure uniform exposure and accurate alignment, ideal for large-format circuit boards.