Type
Equipment
Acronym
ibond
Code
APP/00253
Date of commissioning
01 July 2018 → …
Research disciplines
-
Natural sciences
- Photonics, optoelectronics and optical communications
Keywords
bonding machine
wire bonding
semiautomatic bonder
chip interconnect
Brand Name/manufacturer
ibond 5000
Other information
Description
The iBond 5000 is a semi-automatic wire bonder used for making precise electrical connections in microelectronic packaging.