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Researcher
Stefaan Sercu
Profile
Projects
Publications
Activities
Awards & Distinctions
27
Results
2002
Modeling complex via hole structures.
Eric Laermans
Jan De Geest
Daniël De Zutter
Femke Olyslager
Stefaan Sercu
D MORLION
A1
Journal Article
in
IEEE TRANSACTIONS ON ADVANCED PACKAGING
2002
2001
Modeling differential via holes.
Eric Laermans
Jan De Geest
Daniël De Zutter
Femke Olyslager
Stefaan Sercu
D MORLION
A1
Journal Article
in
IEEE TRANSACTIONS ON ADVANCED PACKAGING
2001
Modelling complex via hole structures
Eric Laermans
Jan De Geest
Daniël De Zutter
Femke Olyslager
Stefaan Sercu
D MORLION
P1
Conference
2001
Modelling complex via hole structures.
Eric Laermans
Jan De Geest
Daniël De Zutter
Femke Olyslager
Stefaan Sercu
D MORLION
C1
Conference
2001
2000
A signal integrity design tool for system interconnects.
Eric Laermans
Jan De Geest
Femke Olyslager
Daniël De Zutter
Stefaan Sercu
D MORLION
C1
Conference
2000
Modelling differential via holes
Eric Laermans
Jan De Geest
Daniël De Zutter
Femke Olyslager
Stefaan Sercu
D MORLION
P1
Conference
2000
Modelling differential via holes.
Eric Laermans
Jan De Geest
Daniël De Zutter
Femke Olyslager
Stefaan Sercu
D MORLION
C1
Conference
2000
1999
Parameter extraction for circuit models of electronic packages without optimization.
Luc Martens
Stefaan Sercu
C1
Conference
1999
1998
Determination of the optimal signal/ground configuration of a multi-pins connector for minimal crosstalk.
Stefaan Sercu
Luc Martens
P1
Conference
1998
Mixed time- and frequency-domain characterisation of a single-ended and coupled interconnections
Stefaan Sercu
Luc Martens
C1
Conference
1998
Multiport measurements
Luc Martens
Stefaan Sercu
C1
Conference
1998
N-port characterisation techniques with application to multi-port connectors and IC- packages
Stefaan Sercu
Luc Martens
C1
Conference
1998
1997
A new approach for the experimental circuit modeling of coupled interconnection structures based on causality.
Stefaan Sercu
Luc Martens
A1
Journal Article
in
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
1997
Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors
Stefaan Sercu
Luc Martens
C1
Conference
1997
Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors
Stefaan Sercu
Luc Martens
P1
Conference
1997
Characterizing N-port packages and interconnections with a 2-port network analyzer
Stefaan Sercu
Luc Martens
P1
Conference
1997
Characterizing N-port packages and interconnections with a 2-port network analyzer
Stefaan Sercu
Luc Martens
C1
Conference
1997
Experimental circuit model generation of non-uniform coupled multi-conductor structures
Stefaan Sercu
Luc Martens
P1
Conference
1997
Experimental circuit model generation of non-uniform coupled multi-conductor structures
Stefaan Sercu
Luc Martens
P1
Conference
1997
Experimental circuit model generation of non-uniform coupled multi-conductor structures
Stefaan Sercu
Luc Martens
C1
Conference
1997
High-frequency circuit modeling of large pin count packages.
Stefaan Sercu
Luc Martens
A1
Journal Article
in
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
1997
1996
A new algorithm for experimental circuit modeling of interconnection structures based on causality.
Stefaan Sercu
Luc Martens
A1
Journal Article
in
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING
1996
High-frequency measurement based characterisation of the transmission line parameters of packages and interconnection structures
Stefaan Sercu
Luc Martens
C1
Conference
1996
High-frequency measurement based characterisation of the transmission line parameters of packages and interconnection structures
Stefaan Sercu
Luc Martens
P1
Conference
1996
1994
Circuit modelling of two-port interconnection structures based on Causality
Stefaan Sercu
Luc Martens
C1
Conference
1994
A procedure for accurate high-frequency characterisation of multi-pins backplane connectors.
L MARTENS
Stefaan Sercu
D MORLION
[0-9]{2}
IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, 0-7803-3034-X/95 IEEE, 2-4 October 1995, Portland, Oregon, USA, pp. 70-72.
L MARTENS
Stefaan Sercu
D MORLION
[0-9]{2}