Manage settings
MENU
About this site
In het Nederlands
Home
Researchers
Projects
Organisations
Outputs & Impact
Infrastructure
Contact
Research Explorer
Your browser does not support JavaScript or JavaScript is not enabled. Without JavaScript some functions of this webapplication may be disabled or cause error messages. To enable JavaScript, please consult the manual of your browser or contact your system administrator.
Researcher
Sam Siau
Profile
Projects
Publications & Research Data
Activities
Awards & Distinctions
Patents
22
Results
2007
XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments
Sam Siau
B DE ROO
Alfons Vervaet
C1
Conference
2007
2006
Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics
Sam Siau
Alfons Vervaet
Etienne Schacht
Ulric Demeter
André Van Calster
A1
Journal Article
in
THIN SOLID FILMS
2006
Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics
Alfons Vervaet
Sam Siau
Johan De Baets
Boniface Manirambona
A1
Journal Article
in
APPLIED SURFACE SCIENCE
2006
Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers
Sam Siau
Alfons Vervaet
Lieven Degrendele
Johan De Baets
André Van Calster
A1
Journal Article
in
APPLIED SURFACE SCIENCE
2006
2005
Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
Sam Siau
Alfons Vervaet
L VAN VAECK
Etienne Schacht
Ulric Demeter
André Van Calster
A1
Journal Article
in
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2005
Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
Sam Siau
Alfons Vervaet
Etienne Schacht
S DEGRANDE
Katrien Callewaert
André Van Calster
A1
Journal Article
in
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2005
Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes
Sam Siau
Alfons Vervaet
S DEGRANDE
Etienne Schacht
André Van Calster
A1
Journal Article
in
APPLIED SURFACE SCIENCE
2005
Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper
Sam Siau
Alfons Vervaet
Etienne Schacht
André Van Calster
C3
Conference
2005
Optimization and modelling of chemically treated build-up epoxy layers
Sam Siau
André Van Calster
Etienne Schacht
Dissertation
2005
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
Sam Siau
Johan De Baets
André Van Calster
L HEREMANS
Sofie Tanghe
A1
Journal Article
in
MICROELECTRONICS RELIABILITY
2005
The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper
Sam Siau
Alfons Vervaet
André Van Calster
Daniël Baert
C1
Conference
2005
2004
Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments
Sam Siau
Alfons Vervaet
André Van Calster
Ives Swennen
Etienne Schacht
A1
Journal Article
in
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2004
Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper
Sam Siau
Alfons Vervaet
André Van Calster
Etienne Schacht
C3
Conference
2004
Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections
Sam Siau
Alfons Vervaet
Etienne Schacht
André Van Calster
A1
Journal Article
in
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2004
Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer
Sam Siau
Alfons Vervaet
André Van Calster
Ives Swennen
Etienne Schacht
A1
Journal Article
in
APPLIED SURFACE SCIENCE
2004
Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - II. Oxidative treatment of the surface
Sam Siau
Alfons Vervaet
Sylvie Nalines
Etienne Schacht
André Van Calster
A1
Journal Article
in
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2004
Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers : I. Sweller influence
Sam Siau
Alfons Vervaet
Sylvie Nalines
Etienne Schacht
André Van Calster
A1
Journal Article
in
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2004
2003
Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers : overplating reliability considerations for the solder mask
Sam Siau
Lieven Degrendele
Johan De Baets
André Van Calster
P1
Conference
2003
Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for usage as build-up layer
Sam Siau
Alfons Vervaet
André Van Calster
S SWENNEN
C1
Conference
2003
Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as build-up layer
Sam Siau
Alfons Vervaet
André Van Calster
Ives Swennen
Etienne Schacht
C1
Conference
2003
Research of novel metal-polymer binding strategies in sequential build-up technology.
Sam Siau
Alfons Vervaet
André Van Calster
Etienne Schacht
C3
Conference
2003
Research of novel metal-polymer binding strategies in sequential buildup substrate technology
Sam Siau
Alfons Vervaet
André Van Calster
Etienne Schacht
C1
Conference
2003