Research Explorer

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Researcher

Sam Siau

Awards & Distinctions

21 Results

2007

XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Sam SiauB DE ROOAlfons Vervaet

2006

Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Sam SiauAlfons VervaetEtienne SchachtUlric DemeterAndré Van Calster

A1 Journal Article in THIN SOLID FILMS

Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Alfons VervaetSam SiauJohan De BaetsBoniface Manirambona

A1 Journal Article in APPLIED SURFACE SCIENCE

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam SiauAlfons VervaetLieven DegrendeleJohan De BaetsAndré Van Calster

A1 Journal Article in APPLIED SURFACE SCIENCE

2005

Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Sam SiauAlfons VervaetL VAN VAECKEtienne SchachtUlric DemeterAndré Van Calster

A1 Journal Article in JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Sam SiauAlfons VervaetEtienne SchachtS DEGRANDEKatrien CallewaertAndré Van Calster

A1 Journal Article in JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Sam SiauAlfons VervaetS DEGRANDEEtienne SchachtAndré Van Calster

A1 Journal Article in APPLIED SURFACE SCIENCE

Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

Sam SiauAlfons VervaetEtienne SchachtAndré Van Calster

Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards

Sam SiauJohan De BaetsAndré Van CalsterL HEREMANSSofie Tanghe

A1 Journal Article in MICROELECTRONICS RELIABILITY

The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper

Sam SiauAlfons VervaetAndré Van CalsterDaniël Baert

2004

Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments

Sam SiauAlfons VervaetAndré Van CalsterIves SwennenEtienne Schacht

A1 Journal Article in JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper

Sam SiauAlfons VervaetAndré Van CalsterEtienne Schacht

Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections

Sam SiauAlfons VervaetEtienne SchachtAndré Van Calster

A1 Journal Article in JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer

Sam SiauAlfons VervaetAndré Van CalsterIves SwennenEtienne Schacht

A1 Journal Article in APPLIED SURFACE SCIENCE

Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - I. Sweller influence

Sam SiauAlfons VervaetS NALINESEtienne SchachtAndré Van Calster

A1 Journal Article in JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - II. Oxidative treatment of the surface

Sam SiauAlfons VervaetS NALINESEtienne SchachtAndré Van Calster

A1 Journal Article in JOURNAL OF THE ELECTROCHEMICAL SOCIETY

2003

Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers : overplating reliability considerations for the solder mask

Sam SiauLieven DegrendeleJohan De BaetsAndré Van Calster

Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for usage as build-up layer

Sam SiauAlfons VervaetAndré Van CalsterS SWENNEN

Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as build-up layer

Sam SiauAlfons VervaetAndré Van CalsterIves SwennenEtienne Schacht

Research of novel metal-polymer binding strategies in sequential build-up technology.

Sam SiauAlfons VervaetAndré Van CalsterEtienne Schacht

Research of novel metal-polymer binding strategies in sequential buildup substrate technology

Sam SiauAlfons VervaetAndré Van CalsterEtienne Schacht